MPC860SRZQ66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,519 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860SRZQ66D4 – MPC8xx 1-Core 32-bit 66 MHz Microprocessor

The MPC860SRZQ66D4 is a single-core 32-bit microprocessor in the MPC860 family designed for embedded communications and controller applications. It implements Power Architecture technology and combines a 66 MHz CPU core with integrated communications support, making it suitable for networking and communications-focused embedded systems.

Key value comes from its integrated communications processor module (CPM), DRAM memory controller, and compact 357-pin PBGA package, providing a balance of processing capability and system-level integration for consumer-grade designs.

Key Features

  • Core  The MPC8xx 32-bit core runs at 66 MHz and implements Power Architecture technology; the family CPU includes memory management units and instruction/data caches as part of the architecture.
  • Communications Processor Module (CPM)  Integrated CPM for communications offload and protocol handling; co-processor functionality targeted at communications tasks.
  • Networking Interfaces  Ethernet capability listed as 10 Mbps (4) and support for HDLC/SDLC additional interfaces, enabling multiple 10 Mbps Ethernet links and serial protocol handling.
  • Memory Controller  On-chip DRAM controller to support system memory configurations and common DRAM types.
  • Package & Mounting  357-PBGA (25 × 25 mm) supplier device package, 357-BBGA case; surface-mount mounting type for compact PCB implementations.
  • Power & I/O  3.3 V I/O voltage specification to match common embedded system power domains.
  • Operating Range  Rated for operation from 0 °C to 95 °C, suitable for consumer environments.
  • Environmental Compliance  RoHS compliant, supporting lead-free assembly processes.

Typical Applications

  • Communications Equipment  Embedded network controllers and communication modules that require integrated CPM functionality and multiple 10 Mbps Ethernet interfaces.
  • Networking Appliances  Small-form-factor routers, gateways, and protocol converters leveraging the MPC8xx core and HDLC/SDLC support for serial communication links.
  • Embedded Controllers  General-purpose embedded control systems that benefit from a 32-bit core with DRAM support and integrated peripheral handling.

Unique Advantages

  • Integrated Communications Engine: CPM and communications-oriented co-processor capabilities reduce host CPU load for protocol handling and data movement.
  • On-Chip DRAM Controller: Simplifies memory subsystem design by supporting DRAM directly, enabling straightforward system integration.
  • Multiple 10 Mbps Ethernet Links: Native support for four 10 Mbps Ethernet interfaces and HDLC/SDLC provides built-in networking connectivity for communications products.
  • Compact PBGA Package: 357-PBGA (25×25 mm) surface-mount package enables space-efficient board designs.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies interfacing with common peripherals and I/O domains.
  • RoHS Compliant: Supports lead-free manufacturing and assembly workflows.

Why Choose MPC860SRZQ66D4?

The MPC860SRZQ66D4 positions itself as an integrated communications-focused microprocessor offering a 32-bit Power Architecture core at 66 MHz combined with a CPM, DRAM controller, and multi-port Ethernet capability. Its compact 357-PBGA package and 3.3 V I/O make it suitable for space-constrained consumer-grade embedded designs that require on-chip communications handling and reliable system integration.

This part is well suited to engineers building networking and communications equipment, embedded controllers, or compact appliances where integrated peripheral support and RoHS-compliant assembly are desired. The MPC860 family’s documented architecture and enhancements supply a practical platform for scalable, communications-centric embedded designs.

Request a quote or submit an inquiry to receive pricing and availability for the MPC860SRZQ66D4. Our team can provide lead-time and ordering information to support your design and procurement needs.

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