MPC860SRZQ66D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,519 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860SRZQ66D4 – MPC8xx 1-Core 32-bit 66 MHz Microprocessor
The MPC860SRZQ66D4 is a single-core 32-bit microprocessor in the MPC860 family designed for embedded communications and controller applications. It implements Power Architecture technology and combines a 66 MHz CPU core with integrated communications support, making it suitable for networking and communications-focused embedded systems.
Key value comes from its integrated communications processor module (CPM), DRAM memory controller, and compact 357-pin PBGA package, providing a balance of processing capability and system-level integration for consumer-grade designs.
Key Features
- Core The MPC8xx 32-bit core runs at 66 MHz and implements Power Architecture technology; the family CPU includes memory management units and instruction/data caches as part of the architecture.
- Communications Processor Module (CPM) Integrated CPM for communications offload and protocol handling; co-processor functionality targeted at communications tasks.
- Networking Interfaces Ethernet capability listed as 10 Mbps (4) and support for HDLC/SDLC additional interfaces, enabling multiple 10 Mbps Ethernet links and serial protocol handling.
- Memory Controller On-chip DRAM controller to support system memory configurations and common DRAM types.
- Package & Mounting 357-PBGA (25 × 25 mm) supplier device package, 357-BBGA case; surface-mount mounting type for compact PCB implementations.
- Power & I/O 3.3 V I/O voltage specification to match common embedded system power domains.
- Operating Range Rated for operation from 0 °C to 95 °C, suitable for consumer environments.
- Environmental Compliance RoHS compliant, supporting lead-free assembly processes.
Typical Applications
- Communications Equipment Embedded network controllers and communication modules that require integrated CPM functionality and multiple 10 Mbps Ethernet interfaces.
- Networking Appliances Small-form-factor routers, gateways, and protocol converters leveraging the MPC8xx core and HDLC/SDLC support for serial communication links.
- Embedded Controllers General-purpose embedded control systems that benefit from a 32-bit core with DRAM support and integrated peripheral handling.
Unique Advantages
- Integrated Communications Engine: CPM and communications-oriented co-processor capabilities reduce host CPU load for protocol handling and data movement.
- On-Chip DRAM Controller: Simplifies memory subsystem design by supporting DRAM directly, enabling straightforward system integration.
- Multiple 10 Mbps Ethernet Links: Native support for four 10 Mbps Ethernet interfaces and HDLC/SDLC provides built-in networking connectivity for communications products.
- Compact PBGA Package: 357-PBGA (25×25 mm) surface-mount package enables space-efficient board designs.
- 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies interfacing with common peripherals and I/O domains.
- RoHS Compliant: Supports lead-free manufacturing and assembly workflows.
Why Choose MPC860SRZQ66D4?
The MPC860SRZQ66D4 positions itself as an integrated communications-focused microprocessor offering a 32-bit Power Architecture core at 66 MHz combined with a CPM, DRAM controller, and multi-port Ethernet capability. Its compact 357-PBGA package and 3.3 V I/O make it suitable for space-constrained consumer-grade embedded designs that require on-chip communications handling and reliable system integration.
This part is well suited to engineers building networking and communications equipment, embedded controllers, or compact appliances where integrated peripheral support and RoHS-compliant assembly are desired. The MPC860 family’s documented architecture and enhancements supply a practical platform for scalable, communications-centric embedded designs.
Request a quote or submit an inquiry to receive pricing and availability for the MPC860SRZQ66D4. Our team can provide lead-time and ordering information to support your design and procurement needs.

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