MPC860SRVR66D4

The MPC860SRVR66D4 is a single‑core, 32‑bit microprocessor IC in the MPC860 family, operating at 66 MHz and implemented on Power Architecture technology. It integrates a RISC communications processor module (CPM), memory controller capabilities and core system features targeted at embedded communications and networking applications.

Designed for embedded systems that require integrated communications peripherals and flexible memory support, the device delivers a compact surface‑mount solution in a 357‑pin PBGA (25×25) package with 3.3 V I/O and an operating range of 0 °C to 95 °C.

Key Features

• Core & Architecture 32‑bit MPC8xx core running at 66 MHz with Power Architecture technology; includes memory management units and instruction/data caches as part of the MPC860 family design.
• Communications Co‑processor (CPM) Integrated CPM for communications offload and protocol handling, supporting common serial and packet interfaces used in networking systems.
• Memory & Controllers DRAM controller support referenced in the device specifications, enabling connection to external DRAM memory types.
• Interfaces & Networking Built‑in communications interfaces including HDLC/SDLC and Ethernet capability (listed as 10 Mbps (4) in the device specification), suitable for embedded network endpoints and control paths.
• System Integration On‑chip features from the MPC860 family include support for PCMCIA socket control (up to two sockets) and an integrated real‑time clock, enhancing peripheral and timekeeping integration.
• Package & Mounting 357‑PBGA (25×25) supplier device package, surface mount mounting type, package case noted as 357‑BBGA for compact board‑level integration.
• Power & Environmental 3.3 V I/O signalling and RoHS compliance; consumer qualification with an operating temperature range of 0 °C to 95 °C.

Typical Applications

• Communications and Networking Equipment — Suited for embedded network controllers and protocol handling where CPM and Ethernet interfaces are required.
• Embedded Control Systems — Single‑core 32‑bit processing and DRAM controller support make the device appropriate for compact embedded control and gateway designs.
• Peripheral Interface Modules — HDLC/SDLC and PCMCIA socket support enable use in modules that bridge legacy serial protocols and removable‑media expansion.

Unique Advantages

• Integrated Communications Processing — The on‑chip CPM reduces external offload requirements, simplifying board-level design for protocol‑intensive applications.
• Flexible Memory Support — DRAM controller capability enables connection to a variety of DRAM types, providing design flexibility for memory‑sized applications.
• Compact PBGA Package — 357‑pin PBGA (25×25) delivers a high‑density footprint for space‑constrained embedded assemblies.
• Standard 3.3 V I/O — 3.3 V signalling aligns with common embedded system voltages for straightforward interfacing.
• Documented PowerQUICC Architecture — Part of the MPC860 PowerQUICC family with detailed datasheet and hardware specifications available for system design and validation.
• Regulatory and Environmental Compliance — RoHS compliant to support environmentally conscious hardware builds.

Why Choose MPC860SRVR66D4?

The MPC860SRVR66D4 positions itself as a purpose‑built embedded microprocessor for communications and networking applications that benefit from an integrated CPM, DRAM controller capability, and a compact BGA package. Its Power Architecture‑based core and MPC860 family heritage provide a documented platform for designers needing established hardware specifications and system‑level integration features such as PCMCIA support and real‑time clock functionality.

This part is well suited to customers developing embedded controllers, networked peripherals, and protocol bridge modules who require a compact, RoHS‑compliant processor solution with standard 3.3 V I/O and an operating range of 0 °C to 95 °C.

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