MPC860SRVR50D4

The MPC860SRVR50D4 is a single‑core 32‑bit microprocessor from the MPC860 family, offering a 50 MHz Power Architecture™ core combined with integrated communications peripherals. It is delivered in a 357‑PBGA (25×25) surface‑mount package and is intended for embedded communications and networking applications.

Designed as a one‑chip integrated microprocessor and peripheral combination with an onboard Communications Processor Module (CPM), the device targets systems that require consolidated control, DRAM memory support, and multiple serial and network interfaces while operating from a 3.3 V I/O supply.

Key Features

• Core  MPC8xx 32‑bit core at 50 MHz providing standard Power Architecture™ processing for embedded control and communications tasks.
• Memory and Controllers  Integrated DRAM controller support to interface with external memory for system and application code.
• Communications Processor Module (CPM)  On‑chip CPM and communications coprocessor functionality to handle serial protocols and offload communication tasks from the CPU.
• Ethernet  Ethernet capability listed as 10 Mbps (4), indicating support for multiple 10 Mbps Ethernet interfaces.
• Serial Protocols  Additional interfaces include HDLC/SDLC for framed serial communications and protocol handling.
• Power and I/O  3.3 V I/O voltage for compatibility with common embedded I/O levels.
• Package and Mounting  357‑PBGA (25×25) supplier device package / 357‑BBGA case, surface‑mount for compact board designs.
• Operating Range  Qualified for consumer applications with an operating temperature range of 0 °C to 95 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Network Interfaces and Gateways  Use the integrated communications capabilities and multiple Ethernet interfaces for compact network controller designs and gateway appliances.
• Embedded Communications Equipment  Suitable for protocol handling and serial communications offload using the CPM and HDLC/SDLC interfaces.
• Industrial and Consumer Networking Devices  Deploy in consumer and light industrial networking equipment that require DRAM support and a robust single‑chip solution.

Unique Advantages

• Integrated Communications Subsystem: The on‑chip CPM and communications coprocessor reduce external component count for serial and protocol handling.
• Single‑Chip Design: Combines CPU, communications peripherals, and memory controller in one package to simplify board layout and system design.
• Compact BGA Package: 357‑PBGA (25×25) package enables high‑density, surface‑mount implementations in space‑constrained embedded products.
• Standard I/O Voltage: 3.3 V I/O simplifies integration with common peripheral devices and modern board power domains.
• RoHS Compliant: Meets environmental compliance requirements for lead‑free designs.

Why Choose MPC860SRVR50D4?

The MPC860SRVR50D4 positions itself as a practical, integrated microprocessor solution for embedded communications and networking designs that need a Power Architecture™ 32‑bit core combined with a Communications Processor Module and DRAM controller. Its single‑chip approach and compact 357‑PBGA package streamline BOM and board complexity for consumer and embedded networking products.

This device is well suited for designers seeking a balanced combination of processing, protocol handling, and multiple Ethernet/serial interfaces within a RoHS‑compliant, surface‑mount package and an industry‑relevant operating temperature range.

Request a quote or submit an inquiry to receive pricing and availability for the MPC860SRVR50D4. Our team can provide further technical details and assistance for integrating this microprocessor into your design.