MPC860SRCVR50D4

The MPC860SRCVR50D4 is a single-core 32-bit microprocessor in the MPC860 PowerQUICC family, operating at 50 MHz and delivered in a 357-pin PBGA (25×25) package. It combines a Power Architecture™ CPU core with an integrated communications processor module (CPM) to address embedded communications and networking applications.

Designed for industrial environments, this device provides on-chip DRAM controller support, multiple communications interfaces and 3.3 V I/O compatibility, offering a highly integrated platform for compact, robust embedded designs.

Key Features

• Core & Architecture 
  32-bit Power Architecture™ CPU core with support for MMUs and instruction/data caches as described in the MPC860 family documentation; operating frequency: 50 MHz.
• Communications Co-Processor (CPM) 
  Integrated CPM supports communications handling and offloads protocol processing from the CPU to streamline network-centric tasks.
• Ethernet & Serial Interfaces 
  Ethernet capability listed as 10Mbps (4) and additional interfaces including HDLC/SDLC for legacy and synchronous protocol support.
• Memory & Storage 
  On-chip memory controller with DRAM support; family documentation also references PCMCIA socket controller support for up to two sockets.
• Power & I/O 
  I/O voltage: 3.3 V, enabling compatibility with common 3.3 V peripherals and logic domains.
• Package & Mounting 
  357-PBGA (25×25) package, surface-mount mounting type, suitable for compact board designs.
• Industrial Qualification & Temperature Range 
  Qualification: Industrial. Operating temperature range: −40 °C to 95 °C for deployment in demanding environments.
• Compliance 
  RoHS compliant.

Typical Applications

• Communications & Networking 
  Embedded routers, switches and protocol gateways that benefit from the onboard CPM and multiple 10 Mbps Ethernet interfaces.
• Industrial Control 
  Automation controllers and industrial gateways that require industrial temperature operation and robust I/O at 3.3 V.
• Legacy Protocol Gateways 
  Systems needing HDLC/SDLC support and deterministic handling of synchronous serial protocols.
• Embedded System Integration 
  Compact, integrated designs where a single-chip microprocessor with DRAM controller simplifies board-level BOM and design.

Unique Advantages

• Integrated Communications Subsystem: The CPM provides dedicated protocol processing to reduce CPU load and simplify network application design.
• Industrial-Grade Operation: Rated for −40 °C to 95 °C and industrial qualification, enabling deployment in temperature-critical environments.
• Compact PBGA Package: 357-PBGA (25×25) delivers a high pin-count footprint in a compact surface-mount form factor for space-constrained boards.
• 3.3 V I/O Compatibility: Standard 3.3 V I/O voltage eases integration with common logic families and peripheral devices.
• On-Chip DRAM Support: Integrated DRAM controller reduces external memory interface complexity for embedded applications.
• Standards-Oriented Interfaces: Built-in support for Ethernet, HDLC/SDLC and related communications interfaces simplifies connectivity for networking products.

Why Choose MPC860SRCVR50D4?

The MPC860SRCVR50D4 positions itself as a compact, industrially qualified embedded processor that combines a Power Architecture™ 32-bit core with an integrated communications processor and memory controller. Its 50 MHz operating point, 3.3 V I/O, and multiple communications interfaces make it suitable for networking-focused embedded systems and industrial controllers that require deterministic protocol handling and robust thermal performance.

For engineers building communications equipment, industrial gateways, or embedded controllers where integration, proven architecture and industrial temperature range matter, this MPC860 family device offers a balanced platform that streamlines system design and supports long-term deployment.

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