MPC860PZQ80D4

IC MPU MPC8XX 80MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)

Quantity 439 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed80MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860PZQ80D4 – IC MPU MPC8XX 80MHZ 357BGA

The MPC860PZQ80D4 is a single‑core, 32‑bit microprocessor IC from the MPC860 family, featuring an 80 MHz core and a 357‑pin PBGA (25×25) package. It is a one‑chip integrated microprocessor and peripheral combination designed for controller applications, with architecture and communications functionality focused on networking and embedded communications systems.

Built on Power Architecture technology, the device includes an integrated Communications Processor Module (CPM) and enhanced memory controller capabilities. The combination of CPU, CPM and multi‑interface support makes it well suited to embedded designs that require on‑chip communications handling and multiple Ethernet connectivity options.

Key Features

  • Core & Architecture 32‑bit MPC8xx core running at 80 MHz; single‑core processor with Power Architecture technology and support for instruction and data caches.
  • Communications Processor Module (CPM) Integrated CPM for communications and protocol handling; supports communications offload and serial protocols referenced in the MPC860 family documentation.
  • Memory & Controllers On‑chip DRAM controller support for external memory interfaces, enabling flexible memory configurations for embedded applications.
  • Ethernet Interfaces Multiple Ethernet MACs: four 10 Mbps ports and one 10/100 Mbps port, enabling multiport networking and gateway designs.
  • Serial and HDLC/SDLC Interfaces Additional interfaces include HDLC/SDLC support for protocol communications commonly used in networking equipment.
  • Power & I/O 3.3 V I/O voltage level for standard embedded system compatibility.
  • Package & Mounting Supplied in a 357‑pin PBGA (25×25) package, surface‑mount mounting for high‑density PCB assembly.
  • Operating Range & Compliance Qualified for consumer applications with an operating temperature range of 0 °C to 95 °C and RoHS‑compliant status.

Typical Applications

  • Communications & Networking Equipment Multiport Ethernet capability and an integrated CPM make the device suitable for routers, switches, and network controllers requiring on‑chip protocol handling.
  • Embedded Controller Systems Single‑chip integration of CPU and peripheral subsystems supports compact controller designs for industrial and commercial embedded applications.
  • Multiport Ethernet Gateways Four 10 Mbps and one 10/100 Mbps Ethernet interfaces enable gateway and aggregation functions in small form‑factor networking devices.
  • Expansion and Legacy Interface Systems Integrated communications features and protocol support are applicable to systems that require HDLC/SDLC or PCMCIA socket controller functionality as referenced in the MPC860 family documentation.

Unique Advantages

  • Integrated Communications Subsystem: On‑chip CPM and communications features reduce external component count and simplify board design for protocol‑heavy applications.
  • Multiport Ethernet Support: Native support for multiple Ethernet ports (four 10 Mbps, one 10/100 Mbps) enables consolidated network interfaces in a single device.
  • Flexible Memory Support: DRAM controller capability provides designers flexibility in choosing memory types to match performance and cost targets.
  • Standard 3.3 V I/O and PBGA Packaging: Industry‑standard 3.3 V I/O and a 357‑pin PBGA package support compatibility with common embedded system designs and high‑density layouts.
  • Documented Hardware Specifications: The MPC860 series is supported by detailed hardware specifications covering power, timing, thermal and electrical characteristics to aid in design and validation.
  • RoHS Compliant: Environmentally compliant design suitable for markets requiring lead‑free components.

Why Choose MPC860PZQ80D4?

The MPC860PZQ80D4 positions itself as an integrated solution for embedded designs that require both a 32‑bit Power Architecture core and dedicated communications capability. Its combination of a single MPC8xx core, integrated CPM, multiport Ethernet, and DRAM controller support makes it appropriate for networking‑centric controllers and compact embedded systems where on‑chip peripheral integration reduces BOM and board complexity.

Backed by comprehensive hardware documentation for the MPC860 family and supplied in a surface‑mount 357‑PBGA package with 3.3 V I/O, this part is suited for engineers seeking a documented, RoHS‑compliant component for communications and controller applications operating within a 0 °C to 95 °C range.

Request a quote or submit a purchase inquiry for the MPC860PZQ80D4 to evaluate its fit for your embedded communications or networking design.

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