MPC860SRCVR66D4

The MPC860SRCVR66D4 is a PowerQUICC-class microprocessor integrating a single 32-bit MPC8xx core running at 66 MHz with on-chip communications functionality. It is designed for embedded communications and networking controller applications where integrated peripheral support and industrial temperature operation are required.

Key value comes from its integrated communications co-processor (CPM), DRAM controller and multiple serial/packet interfaces, combined with a robust industrial qualification and RoHS compliance for reliable deployment in industrial embedded systems.

Key Features

• Core  Single MPC8xx 32-bit core operating at 66 MHz, providing deterministic processing for embedded control and communications tasks.
• Communications Co-Processor (CPM)  On-chip CPM specialized for communications and protocol handling to offload the main CPU.
• Memory  Integrated DRAM controller to support external memory configurations required by embedded applications.
• Interfaces  Includes HDLC/SDLC support and integrated Ethernet capability (specified as 10 Mbps (4)); suitable for packet and serial communications.
• Power and I/O  I/O voltage: 3.3 V for compatibility with common embedded I/O standards.
• Package & Mounting  357-PBGA (25x25) package, surface-mount mounting for compact board designs.
• Qualification & Temperature  Industrial qualification with specified operating temperature range of −40 °C to 95 °C for deployment in harsh environments.
• Compliance  RoHS compliant to meet lead-free assembly requirements.

Typical Applications

• Communications & Networking Equipment  Integrated CPM and Ethernet support make this device suitable for embedded network controllers and packet processing functions.
• Industrial Control  Industrial temperature qualification and integrated interfaces support industrial automation controllers and remote I/O gateways.
• Embedded Communications Controllers  On-chip protocol engines (HDLC/SDLC) and DRAM controller enable compact, single-chip communications solutions.

Unique Advantages

• Integrated Communications Subsystem: The CPM and HDLC/SDLC interfaces offload protocol processing from the CPU, simplifying design and improving throughput for communications tasks.
• Compact PBGA Package: 357-PBGA (25x25) surface-mount package enables high-density board layouts while providing the connectivity required for embedded systems.
• Industrial Temperature Range: Rated for −40 °C to 95 °C, supporting operation in demanding environmental conditions common in industrial deployments.
• Standard 3.3 V I/O: Compatible with widely used embedded I/O voltage levels for straightforward integration into existing designs.
• RoHS Compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose MPC860SRCVR66D4?

The MPC860SRCVR66D4 combines a 32-bit MPC8xx core with an integrated communications processor and DRAM controller to deliver a compact, communications-focused embedded solution. Its 66 MHz operation, 3.3 V I/O, and industrial temperature qualification make it a practical choice for embedded networking and industrial control applications that require reliable, long-term operation.

This device is suited to designers seeking an integrated communications controller platform with proven PowerQUICC-class architecture and the peripheral set needed to implement serial and Ethernet-based communications in constrained board-space environments.

Request a quote or submit a quote for the MPC860SRCVR66D4 to get pricing and availability for your next embedded communications design.