MPC860PZQ50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,472 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860PZQ50D4 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860PZQ50D4 is a single‑core, 32‑bit microprocessor in the MPC860 family, implementing Power Architecture technology. Operating at 50 MHz with a 3.3 V I/O domain, it integrates communications‑oriented peripherals and controllers to address embedded communications and networking applications.
With an on‑chip communications processor module (CPM), DRAM memory controller and multiple Ethernet interfaces, this device targets consumer communications and controller applications that require integrated protocol handling and networking connectivity.
Key Features
- 32‑bit Power Architecture Core Single 32‑bit MPC8xx core running at 50 MHz designed for embedded control and communications tasks.
- Communications Processor (CPM) Integrated CPM for offloading communications processing and protocol handling, with additional communications/DSP capability.
- Memory Support On‑chip DRAM controller enabling support for external DRAM memory types typical in embedded designs.
- Ethernet Connectivity Multiple Ethernet ports: four 10 Mbps interfaces and one 10/100 Mbps interface, suited for multi‑port networking functions.
- Serial Protocol Interfaces Additional interfaces include HDLC/SDLC for serial protocol support and inter‑integrated controller (I2C) channel in the family architecture.
- Power and Packaging 3.3 V I/O operation, supplied in a 357‑pin PBGA (25 × 25 mm) surface‑mount package for compact board integration.
- Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Communications Equipment Multi‑port Ethernet and CPM functionality make the device suitable for consumer networking gear that requires integrated protocol handling.
- Embedded Controllers Single‑core Power Architecture CPU with DRAM controller supports general embedded control tasks in consumer applications.
- Protocol Offload and Serial Networking HDLC/SDLC interfaces and CPM capabilities allow protocol processing and serial link management in communication subsystems.
- PCMCIA/Expansion Controller Designs Family documentation indicates support for PCMCIA socket control, enabling designs that require removable expansion interfaces.
Unique Advantages
- Integrated Communications Engine: CPM and dedicated communications/DSP resources reduce external component count for protocol‑centric designs.
- Multi‑port Ethernet Support: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible connectivity options for consumer networking applications.
- Memory Flexibility: On‑chip DRAM controller enables use of a range of DRAM types to match system performance and cost targets.
- Compact PBGA Packaging: 357‑pin PBGA (25×25 mm) surface‑mount package offers a high‑density footprint for space‑constrained boards.
- Documented Architecture: Backed by MPC860 family hardware documentation and user manuals for system integration and thermal/electrical design guidance.
- Regulatory and Assembly Friendly: RoHS compliant and consumer‑qualified, simplifying regulatory and assembly considerations for consumer products.
Why Choose MPC860PZQ50D4?
The MPC860PZQ50D4 combines a Power Architecture 32‑bit core with an integrated communications processor and multi‑port Ethernet to deliver a compact, well‑documented solution for consumer communications and embedded controller applications. Its on‑chip DRAM controller and surface‑mount 357‑pin PBGA package enable flexible memory options and dense board designs.
This device suits designers seeking a single‑chip communications‑centric MPU with established documentation and practical operating characteristics (3.3 V I/O, 0 °C to 95 °C). It is appropriate for consumer networking and protocol offload designs where integration and connectivity are primary requirements.
Request a quote or submit an inquiry for pricing and availability of MPC860PZQ50D4 to evaluate its fit for your next embedded communications design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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