MPC860SRVR50D4R2

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 518 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860SRVR50D4R2 – IC MPU MPC8XX 50 MHz, 32‑Bit, 357‑PBGA (25×25)

The MPC860SRVR50D4R2 is a member of the MPC860 PowerQUICC family: a one‑core, 32‑bit microprocessor IC running at 50 MHz with integrated communications peripherals. It combines a Power Architecture™‑based CPU core with a communications processor module (CPM) and a range of on‑chip controllers to address embedded controller and communications applications.

Designed for controller and networking‑oriented systems, the device emphasizes integration and peripheral support — including DRAM controllers, HDLC/SDLC interfaces and Ethernet capability — in a compact 357‑PBGA surface‑mount package.

Key Features

  • Core & Performance Single MPC8xx 32‑bit core operating at 50 MHz for control and communications processing.
  • Communications Processor (CPM) Integrated CPM and communications‑focused co‑processor functionality to support protocol handling and offload.
  • Memory & Controllers On‑chip support for DRAM controllers to interface with external memory devices.
  • Ethernet & Serial Interfaces Ethernet capability listed as 10Mbps (4) and additional serial interfaces including HDLC/SDLC for framed communications.
  • I/O Voltage 3.3 V I/O compatibility for a wide range of embedded peripherals and board designs.
  • Package & Mounting 357‑PBGA (25×25) supplier device package / 357‑BBGA case in a surface‑mount form factor to optimize board area.
  • Operating Range Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
  • Integrated Peripherals Series documentation highlights integrated MMUs, instruction/data caches, a PCMCIA socket controller (up to two sockets) and a real‑time clock as part of the MPC860 family feature set.

Typical Applications

  • Communications & Networking Systems Suited for embedded communications tasks and networking‑oriented controller functions where integrated CPM support is beneficial.
  • Embedded Controller Designs Compact single‑chip solution for embedded controllers requiring DRAM interfacing and serial framing protocols (HDLC/SDLC).
  • PCMCIA‑Based Systems Designs that use PCMCIA sockets can leverage the MPC860 family’s integrated socket controller capability (supports up to two sockets).
  • Time‑Aware Embedded Applications Systems requiring an integrated real‑time clock and deterministic communications handling can make use of the on‑chip RTC and CPM features.

Unique Advantages

  • Highly integrated communications support: On‑chip CPM and serial protocol interfaces reduce external component count and simplify board design.
  • Memory controller integration: DRAM controller support enables straightforward memory interfacing for data buffering and code storage.
  • Compact PBGA package: The 357‑PBGA (25×25) surface‑mount package provides a small footprint for space‑constrained embedded boards.
  • Broad peripheral set from the MPC860 family: Family documentation indicates integrated MMUs, instruction/data caches, PCMCIA controller and RTC — useful for embedded communications platforms.
  • Design‑friendly I/O voltage: 3.3 V I/O compatibility helps ensure straightforward integration with common peripherals and transceivers.
  • RoHS compliant and consumer qualified: Conforms to environmental requirements and is targeted for consumer‑grade applications.

Why Choose MPC860SRVR50D4R2?

The MPC860SRVR50D4R2 positions itself as an integrated microprocessor solution for embedded communications and controller designs that require a balanced mix of CPU capability and on‑chip communications peripherals. With the MPC8xx core, CPM integration, DRAM controller support and serial protocol interfaces, it streamlines designs that need protocol handling and memory interfacing in a compact PBGA package.

This part is appropriate for engineers and teams building consumer‑grade embedded systems and communications equipment who value integration, documented family support, and a small‑footprint surface‑mount package. The availability of MPC860 family hardware documentation supports design, thermal and electrical planning throughout development.

Request a quote or submit your inquiry for pricing and availability of the MPC860SRVR50D4R2 to receive detailed procurement information.

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