MPC860TVR50D4R2

The MPC860TVR50D4R2 is a single‑core, 32‑bit microprocessor from the NXP Semiconductors MPC860 (PowerQUICC) family, offering a 50 MHz core clock and integrated communications features. It targets embedded communications and networking applications where integrated peripherals, deterministic processing, and compact package size are important.

Built around the MPC8xx core architecture with an integrated communications processor module (CPM), this device combines on‑chip memory management features and high‑density I/O in a 357‑pin PBGA (25×25) surface‑mount package. It is RoHS compliant and specified for consumer qualification and an operating range of 0 °C to 95 °C.

Key Features

• Core & Architecture  The MPC8xx 32‑bit core runs at 50 MHz and includes Power Architecture™ technology elements such as memory management units (MMUs) and instruction/data caches (as documented for the MPC860 family).
• Communications Processor Module (CPM)  Integrated CPM supports communications offload and protocol handling; co‑processor DSP capability is listed as Communications/CPM.
• Ethernet Interfaces  Multiple Ethernet ports are supported: four 10 Mbps ports and one 10/100 Mbps port, enabling multi‑port network applications.
• Memory & Bus  On‑chip DRAM controller support simplifies external memory interfacing for system designs requiring DRAM.
• Peripheral Interfaces  Additional interfaces include HDLC/SDLC support for serial link protocols and PCMCIA/real‑time clock features referenced in the MPC860 family documentation.
• Power & IO  Designed for 3.3 V I/O operation, suitable for common embedded system voltage domains.
• Package & Mounting  357‑pin PBGA (25×25) supplier device package, surface mount, providing a compact footprint for board designs.
• Temperature & Qualification  Consumer qualification with an operating temperature range of 0 °C to 95 °C.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Embedded Communications Controllers  Used in embedded systems that require integrated serial protocol handling and CPM offload for communication tasks.
• Network Equipment  Suited for multi‑port Ethernet devices and mid‑range networking appliances leveraging multiple 10 Mbps and 10/100 Mbps ports.
• Industrial and Consumer Networking Products  Applicable where a compact PBGA package and consumer‑grade temperature range meet product cost and size targets.

Unique Advantages

• Integrated Communications Subsystem  On‑chip CPM and communications DSP capability reduce external components and simplify protocol implementations.
• Multiple Ethernet Ports  Native support for several Ethernet interfaces enables multi‑port designs without extensive external switching.
• Memory Flexibility  DRAM controller support eases system memory design and supports a range of external memory options.
• Compact PBGA Footprint  357‑pin PBGA (25×25) surface‑mount package provides a dense, board‑space efficient solution for embedded applications.
• Documented Family-Level Features  The MPC860 family documentation details MMUs, caches, and peripheral integration that assist system architects in evaluating fit for communications‑focused designs.
• Regulatory and Manufacturing Readiness  RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose MPC860TVR50D4R2?

The MPC860TVR50D4R2 positions itself as a capable, communications‑focused microprocessor for embedded and networking designs that need integrated protocol handling, multi‑port Ethernet connectivity, and a compact PBGA package. Its MPC8xx core and CPM architecture offer a balance of processing and communications offload for systems where integrated peripherals reduce bill‑of‑materials and board complexity.

This part is appropriate for designers targeting consumer‑grade networked devices and embedded controllers that operate within a 0 °C to 95 °C range and 3.3 V I/O environments. With family‑level documentation covering memory management, caching, and peripheral integration, the MPC860TVR50D4R2 supports system development requiring predictable communications capabilities and a compact hardware footprint.

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