MPC860TZQ50D4R2

The MPC860TZQ50D4R2 is a single‑core, 32‑bit MPC8xx microprocessor running at 50 MHz, packaged in a 357‑pin PBGA (25×25) for surface‑mount applications. Built on Power Architecture™ technology, the device integrates a communications processor module (CPM), DRAM controller capability and multiple Ethernet interfaces to address embedded communications and controller applications.

This member of the MPC860 PowerQUICC family is targeted at embedded networking and communications systems where integration, on‑chip communications support and established documentation for system design are important design considerations.

Key Features

• Core and Architecture 32‑bit MPC8xx core built on Power Architecture™ technology; single‑core configuration suitable for embedded control and communications tasks.
• Performance 50 MHz operating frequency for deterministic embedded processing in control and networking applications.
• Memory and Controllers Integrated DRAM controller support to interface with external memory devices required by system firmware and data buffering.
• Communications Processing (CPM) On‑chip Communications Processor Module (CPM) and communications/DSP co‑processing capabilities to offload protocol and data‑movement tasks.
• Ethernet Interfaces Multiple Ethernet ports: four 10 Mbps ports plus one 10/100 Mbps port, enabling multi‑port networking designs and partitioned communication links.
• Peripheral Interfaces Additional serial protocol interfaces including HDLC/SDLC for legacy and protocol‑oriented applications.
• Power and I/O 3.3 V I/O voltage for common embedded I/O compatibility.
• Package and Mounting 357‑PBGA (25×25) surface‑mount package for compact board integration.
• Operating Range Rated for operation from 0 °C to 95 °C for consumer‑grade embedded environments.
• Compliance RoHS compliant.

Typical Applications

• Embedded Networking Equipment Multi‑port Ethernet capability and an integrated CPM make the device suitable for small routers, switches and line interface controllers.
• Communications Controllers On‑chip communications and HDLC/SDLC interfaces support protocol handling and legacy serial link management in communications appliances.
• Industrial and Embedded Control Deterministic single‑core processing with DRAM support fits controller applications that require reliable data buffering and protocol offload.
• System Integration Modules Compact PBGA package and 3.3 V I/O enable integration into space‑constrained modules and embedded boards.

Unique Advantages

• Integrated Communications Subsystem: On‑chip CPM and communications co‑processor functionality reduce external component count and simplify protocol handling.
• Multi‑port Ethernet Support: Four 10 Mbps ports plus one 10/100 Mbps port enable flexible network segmentation and multiple simultaneous links.
• Compact Surface‑Mount Package: 357‑PBGA (25×25) footprint supports high‑density board layouts while keeping I/O and processing consolidated.
• Established Architecture and Documentation: Part of the MPC860 PowerQUICC family with detailed hardware specifications and user documentation to support design and validation.
• Wide Consumer Temperature Range: 0 °C to 95 °C operating range suitable for a variety of consumer and embedded environments.
• RoHS Compliant: Conforms to RoHS requirements for lead‑free manufacturing processes.

Why Choose MPC860TZQ50D4R2?

The MPC860TZQ50D4R2 delivers a balanced combination of a Power Architecture™ 32‑bit core, integrated communications processing and multi‑port Ethernet connectivity in a compact 357‑pin PBGA package. It is positioned for embedded designs that require on‑chip protocol support, DRAM interfacing and a clear hardware specification for implementation.

This device is well suited to engineers designing networking, communications and embedded control systems who value integration, established documentation and straightforward system partitioning between CPU and communications co‑processing.

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