MPC860TZQ66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 57 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860TZQ66D4 – IC MPU MPC8XX 66MHz 357-BGA

The MPC860TZQ66D4 is a single‑core, 32‑bit microprocessor in the MPC8xx family designed for integrated communications and controller applications. It implements Power Architecture technology and combines a 66 MHz CPU core with an enhanced communications processor module (CPM) and on‑chip peripherals for networking and embedded systems.

Targeted at communications and networking systems, the device delivers integrated memory and I/O support, multiple Ethernet interfaces, and on‑chip controllers that reduce system complexity and BOM for consumer‑grade embedded designs.

Key Features

  • Core & Architecture 32‑bit MPC8xx core running at 66 MHz with Power Architecture technology; includes memory management units (MMUs) and instruction/data caches.
  • Communications Processor Module (CPM) Integrated CPM for communications tasks and co‑processor functionality; supports HDLC/SDLC and other protocol interfaces.
  • Ethernet Interfaces Multiple onboard Ethernet ports: four 10 Mbps interfaces and one 10/100 Mbps interface, enabling varied networking topologies.
  • Memory Support Enhanced memory controller with DRAM support and compatibility with high‑performance memory types.
  • On‑chip Peripherals Integrated real‑time clock and PCMCIA socket controller functionality as described in the product family documentation.
  • Power and I/O I/O operating voltage: 3.3 V, suitable for common embedded I/O domains.
  • Package & Mounting 357‑PBGA (25x25) supplier package, 357‑BBGA case type; surface‑mount device for compact board designs.
  • Operating Range & Compliance Consumer qualification with operating temperature range 0 °C to 95 °C and RoHS compliance.
  • Graphics & DSP No dedicated graphics acceleration; communications‑focused DSP/CPM functionality is provided for protocol handling.

Typical Applications

  • Communications and Networking Systems Integration of CPU and CPM makes the part suitable for embedded network controllers and communication endpoints where multiple Ethernet interfaces are required.
  • Embedded Controller Applications Single‑chip solution for general-purpose embedded controllers that require on‑chip memory management and peripheral integration.
  • PCMCIA‑Enabled Devices On‑chip PCMCIA socket controller functionality supports designs that require removable card interfaces.

Unique Advantages

  • Integrated Communications Subsystem On‑chip CPM and HDLC/SDLC support reduce external logic for protocol handling and simplify board design.
  • Multiple Ethernet Ports Four 10 Mbps and one 10/100 Mbps Ethernet interfaces provide flexible connectivity options for networking applications.
  • Flexible Memory Support Enhanced memory controller supports DRAM and high‑performance memories, enabling a range of memory architectures.
  • Compact Surface‑Mount Package 357‑PBGA (25x25) package delivers dense integration for space‑constrained embedded systems.
  • Consumer‑Grade Thermal Range Rated for 0 °C to 95 °C operation to meet typical consumer embedded product environments.
  • Standards‑Aware Compliance RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose MPC860TZQ66D4?

The MPC860TZQ66D4 positions itself as a compact, communications‑oriented microprocessor that combines a Power Architecture 32‑bit core with an enhanced CPM and multiple Ethernet interfaces. Its integrated memory controller, PCMCIA support, and on‑chip peripherals address the needs of embedded networking and controller designs where board‑level integration and predictable performance are important.

This part is suited to engineers and procurement teams building consumer‑grade embedded systems that require a single‑chip solution with 3.3 V I/O, surface‑mount PBGA packaging, and a specified operating range. The device’s integration can help reduce BOM and simplify design verification by consolidating CPU, communications, and memory interfaces on one device.

Request a quote or submit a quote today to evaluate the MPC860TZQ66D4 for your embedded communications or controller design needs.

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