MPC860TZQ80D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,442 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 80MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860TZQ80D4 – IC MPU MPC8XX 80MHz 357BGA
The MPC860TZQ80D4 is a single‑core, 32‑bit microprocessor from the MPC860 PowerQUICC family, implementing Power Architecture technology for embedded controller and communications applications. It combines an 80 MHz CPU core with on‑chip communications processing (CPM) and a flexible memory controller to support DRAM and a variety of system peripherals.
Designed for networking and controller use cases, the device delivers integrated Ethernet ports and HDLC/SDLC interfaces, a surface‑mount 357‑PBGA (25×25) package, and operation across a 0 °C to 95 °C range—providing a compact, RoHS‑compliant solution for embedded communications designs.
Key Features
- Core & Architecture 32‑bit MPC8xx core running at 80 MHz with Power Architecture technology; includes memory management units (MMUs) and instruction/data caches as described for the MPC860 family.
- Communications Processor (CPM) Integrated CPM for communications offload and protocol handling; supports HDLC/SDLC interfaces and communications co‑processor functionality.
- Ethernet Connectivity Multiple Ethernet ports: four 10 Mbps ports and one 10/100 Mbps port for system networking and multiple link endpoints.
- Memory Support On‑chip DRAM controller with family documentation indicating support for a range of DRAM types to match system memory needs.
- I/O Voltage 3.3 V I/O signaling for compatibility with common embedded peripherals and boards.
- Package & Mounting 357‑PBGA (25×25) / 357‑BBGA surface‑mount package for compact board layouts and high‑density systems.
- Operating Range & Compliance Qualified for consumer applications with an operating temperature range of 0 °C to 95 °C and RoHS compliant status.
Typical Applications
- Communications & Networking Equipment — Suited for embedded networking systems that require integrated Ethernet ports and protocol processing.
- Embedded Controller Applications — Single‑chip controller designs that benefit from on‑chip CPM, MMUs, and cache for deterministic embedded processing.
- Protocol Handling and Serial Communications — Systems using HDLC/SDLC interfaces and CPM offload for efficient packet processing and serial protocol timing.
- Systems Requiring DRAM Support — Designs that use on‑board DRAM supported by the MPC860 family memory controller for larger runtime datasets.
Unique Advantages
- Integrated Communications Engine: CPM and serial protocol interfaces reduce external controller requirements and simplify board‑level design for networking tasks.
- Multiple Ethernet Ports: Built‑in four 10 Mbps ports plus one 10/100 Mbps port enable multi‑link connectivity without additional PHY devices.
- Flexible Memory Interface: DRAM controller support accommodates a variety of DRAM types to match application memory needs and system performance targets.
- Compact, Surface‑Mount Package: 357‑PBGA (25×25) package supports dense PCB layouts while maintaining signal integrity for high‑I/O designs.
- Documented Architecture and Support: MPC860 family documentation (hardware specification and user manuals) provides detailed electrical, timing, and design guidance for integration.
- Regulatory and Assembly Friendly: RoHS‑compliant and consumer‑qualified for streamlined procurement and manufacturing.
Why Choose MPC860TZQ80D4?
The MPC860TZQ80D4 positions itself as a compact, communications‑focused embedded processor combining a Power Architecture 32‑bit core, integrated CPM, and multiport Ethernet connectivity—making it a practical choice for embedded networking and controller applications that require protocol offload and on‑chip memory management. Its 3.3 V I/O, DRAM controller, and documented family specifications support robust system integration and reliable operation across the specified 0 °C to 95 °C range.
This device is well suited for engineering teams building embedded communications products that prioritize integration, deterministic protocol handling, and compact packaging, backed by the MPC860 family’s technical documentation and design guidance.
Request a quote or submit an inquiry to receive pricing and availability information for the MPC860TZQ80D4.

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