MPC860TZQ50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 1,384 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860TZQ50D4 – IC MPU MPC8XX 50MHZ 357BGA

The MPC860TZQ50D4 is a single-core, 32-bit microprocessor from NXP Semiconductors’ MPC860 PowerQUICC family, operating at 50 MHz. It implements Power Architecture technology and integrates communications-oriented peripherals to address embedded controller and networking applications.

Designed for communications and controller use, the device combines a Power Architecture CPU with a Communications Processor Module (CPM), DRAM interfacing, multiple Ethernet ports and common serial protocols to simplify system-level integration.

Key Features

  • Core – Single 32-bit MPC8xx core operating at 50 MHz with memory management units and instruction/data caches as part of the MPC860 family architecture.
  • Memory and Controllers – Integrated DRAM controller to support external memory; MMU and instruction/data caches for efficient code and data handling.
  • Communications & CPM – Communications co-processor (CPM) for protocol handling; series documentation notes inclusion of an inter-integrated controller (I2C) channel and support for communications processing.
  • Serial Protocols – Additional interfaces include HDLC/SDLC for serial link framing and protocol support.
  • Ethernet – Multi-port Ethernet capability: four 10 Mbps ports and one 10/100 Mbps port, suitable for embedded networking tasks.
  • Package and Mounting – 357-ball PBGA package (357-PBGA, 25×25) in a surface-mount form factor.
  • Power and I/O – I/O voltage at 3.3 V to match common embedded system power rails.
  • Operating Conditions & Qualification – Consumer-qualified device with an operating temperature range of 0 °C to 95 °C.
  • Environmental Compliance – RoHS compliant.

Typical Applications

  • Communications and Networking Equipment – Suitable for embedded gateways, controllers and networked appliances requiring integrated Ethernet and protocol processing.
  • Embedded Controller Systems – Single-core 32-bit processing with DRAM support and MMU/cache makes it applicable to control-oriented embedded designs.
  • PCMCIA and Card-Based Interfaces – MPC860 series documentation indicates PCMCIA socket controller support, enabling use in systems that require removable-card connectivity.

Unique Advantages

  • Highly integrated communications support: CPM plus HDLC/SDLC interfaces and multiple Ethernet ports reduce external protocol hardware and simplify board-level design.
  • Power Architecture processing with MMU and caches: On-chip MMU and instruction/data caches improve software execution efficiency for embedded workloads.
  • Flexible memory interfacing: Built-in DRAM controller supports a range of memory types to match system performance and capacity needs.
  • Compact PBGA footprint: 357-PBGA (25×25) surface-mount package enables dense PCB layouts for space-constrained designs.
  • RoHS compliant and consumer qualified: Meets environmental compliance requirements and is specified for consumer-grade operating conditions.

Why Choose MPC860TZQ50D4?

The MPC860TZQ50D4 positions itself as an integrated communications-focused microprocessor offering a 50 MHz Power Architecture core combined with CPM-based protocol handling, multi-port Ethernet, and DRAM interfacing. It is suited for designers building embedded networking and controller products that require consolidated communications peripherals and conventional consumer-grade operating range.

Backed by NXP Semiconductors’ MPC860 family documentation, this part is appropriate for projects that prioritize integration, predictable operating conditions, and a compact PBGA package for surface-mount assembly.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC860TZQ50D4.

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