MPC860TVR80D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 517 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 80MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860TVR80D4 – IC MPU MPC8XX 80MHZ 357BGA
The MPC860TVR80D4 is a single-core, 32-bit microprocessor from the MPC860 family, built on Power Architecture technology and optimized for integrated communications and control applications. The device combines a 80 MHz CPU core with an enhanced Communications Processor Module (CPM) and flexible memory support to address embedded networking and controller use cases.
Designed for embedded and communications markets, the MPC860TVR80D4 offers an integrated peripheral set, multi-port Ethernet connectivity and a compact 357-pin PBGA package for deployment in space-constrained, surface-mount designs.
Key Features
- Core and Architecture – MPC8xx 32-bit single core CPU operating at 80 MHz; built on Power Architecture technology with MMU and instruction/data caches per MPC860 family documentation.
- Communications Processor Module (CPM) – On-chip CPM for communications handling and protocol offload, suitable for serial and link-level processing.
- Memory Support – Integrated DRAM controller support for external memory; flexible memory interface for embedded system designs.
- Ethernet Connectivity – Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port to support mixed-speed network topologies.
- Interfaces – Additional interface support including HDLC/SDLC; CPM enhancements include an inter-integrated controller (I2C) channel as noted in family documentation.
- Power and I/O – 3.3 V I/O supply to align with common embedded interface voltage levels.
- Package and Mounting – 357-PBGA (25 × 25 mm) supplier device package, surface-mount for compact board-level integration.
- Operating Range – Rated for operation from 0 °C to 95 °C; qualification level: Consumer.
- Compliance – RoHS compliant material status.
Typical Applications
- Communications and Networking Equipment – Integrated CPU and CPM make this device suitable for protocol processing, line interface handling and network control functions.
- Embedded Controllers – 32-bit core with MMU and caches supports general-purpose embedded control tasks that require deterministic processing at 80 MHz.
- Network Interface Modules – Multiple Ethernet ports enable use in network interface cards, small routers or managed switches needing mixed-speed connectivity.
- Doorway Devices and Peripheral Controllers – Compact PBGA package and surface-mount mounting make it suitable for space-limited modules that require DRAM-backed memory and serial protocol support.
Unique Advantages
- Highly integrated communications capability: Combines a Power Architecture CPU with an enhanced CPM to reduce external peripheral count and simplify protocol handling.
- Multiport Ethernet support: Built-in multiple 10 Mbps and a 10/100 Mbps Ethernet port allow flexible network connectivity without additional MAC devices.
- Flexible memory interface: DRAM controller support permits use of common external memory types to match system performance and capacity needs.
- Compact surface-mount package: 357-PBGA (25×25 mm) reduces board area while providing a high pin count for I/O and peripheral integration.
- Industry-standard I/O voltage: 3.3 V I/O simplifies integration with common embedded peripherals and transceivers.
- RoHS compliant: Meets environmental material requirements for modern electronics manufacturing.
Why Choose MPC860TVR80D4?
The MPC860TVR80D4 positions itself as a practical choice for embedded designs that require an integrated communications-focused microprocessor with a proven architecture. With a 32-bit Power Architecture core, CPM-based protocol handling, multiport Ethernet and DRAM support, it targets designers building compact networked controllers and interface modules.
Backed by manufacturer documentation for the MPC860 family, this consumer-qualified part offers a blend of integration and predictable operating range for production systems where consolidation of CPU and communications functions reduces BOM and simplifies board design.
Request a quote or submit an inquiry to get pricing and availability for the MPC860TVR80D4 and to discuss lead times or volume requirements.

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