MPC860PCZQ66D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 993 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860PCZQ66D4 – IC MPU MPC8XX 66MHZ 357BGA
The MPC860PCZQ66D4 is a single‑core, 32‑bit MPC8xx microprocessor from NXP Semiconductors designed as an integrated communications and control solution. Built on Power Architecture technology, the device combines a CPU core with a Communications Processor Module (CPM) and a flexible memory controller to address embedded communications and controller applications.
With a 66 MHz clock, integrated CPM communications capabilities, multiple Ethernet interfaces and industrial temperature qualification, this MPU targets networking and embedded controller applications that require robust connectivity and system integration in a compact surface‑mount package.
Key Features
- Core and Architecture — Single 32‑bit MPC8xx core based on Power Architecture technology with integrated MMU and instruction/data caches as part of the MPC860 family.
- Clock Speed — Operates at 66 MHz to meet control and communication timing requirements.
- Communications Processor Module (CPM) — On‑chip CPM for communications handling and DSP‑style co‑processor support for communications tasks.
- Ethernet Connectivity — Multi‑port Ethernet support with four 10 Mbps ports and one 10/100 Mbps port for diverse network interfacing.
- Memory Support — Integrated DRAM memory controller to support system memory requirements for embedded applications.
- Interfaces — Additional serial protocol support including HDLC/SDLC for framed serial communications.
- Power and I/O — 3.3 V I/O voltage compatibility for standard embedded interfaces.
- Industrial Qualification — Qualified for industrial use with an operating temperature range of -40 °C to 95 °C.
- Package and Mounting — 357‑PBGA (25×25) supplier package, 357‑BBGA package case, surface‑mount mounting for compact PCB integration.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Networking Equipment — Ideal for embedded routers, switches or line cards that require multiple Ethernet interfaces and on‑chip communications handling.
- Communications Appliances — Suited to protocol gateways, modem controllers and serial framed‑link devices leveraging HDLC/SDLC and the CPM.
- Industrial Controllers — Used in industrial control systems that demand DRAM support, 3.3 V I/O compatibility and extended temperature operation.
- Embedded Systems — Appropriate for compact, integrated one‑chip controller designs where CPU, communications and memory control are required in a single package.
Unique Advantages
- Integrated Communications Subsystem: On‑chip CPM and communications co‑processor support reduce external component count and simplify board design for protocol handling.
- Multi‑port Ethernet Support: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible LAN connectivity options without additional PHYs for each link.
- Industrial Temperature Range: Rated from -40 °C to 95 °C for reliable operation in demanding environments.
- Compact BGA Package: 357‑PBGA (25×25) surface‑mount package enables high‑density PCB layouts while maintaining thermal and mechanical robustness.
- System Memory Flexibility: Integrated DRAM controller supports a range of memory choices to match application performance and capacity needs.
- RoHS Compliant: Environmentally compliant manufacture eases integration into modern product supply chains.
Why Choose MPC860PCZQ66D4?
The MPC860PCZQ66D4 positions itself as a compact, integrated solution for embedded communications and controller applications that require a single 32‑bit core, on‑chip communications processing and multiple Ethernet interfaces. Its industrial temperature rating and DRAM controller make it suitable for robust, production‑grade systems where connectivity and integration reduce system complexity.
Manufactured by NXP Semiconductors and conforming to RoHS, this MPC860 device offers a balance of integration, environmental compliance and practical performance for teams designing networking appliances, industrial controllers and embedded communication systems.
Request a quote or submit a request for pricing and availability to begin evaluating MPC860PCZQ66D4 for your next embedded communications design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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