MPC860PVR50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 702 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860PVR50D4 – IC MPU MPC8XX 50MHZ 357BGA

The MPC860PVR50D4 is a single‑core 32‑bit microprocessor from the MPC860 PowerQUICC family, built on the MPC8xx core architecture and optimized for communications and embedded networking applications. With a 50 MHz CPU, integrated Communications Processor Module (CPM), DRAM controller and multiple Ethernet interfaces, it delivers a compact, integrated solution for embedded controllers and networked devices.

This device targets consumer‑grade embedded designs requiring a surface‑mount 357‑PBGA (25×25) package, 3.3 V I/O and an operating temperature range of 0 °C to 95 °C. It is RoHS compliant and qualified for consumer applications.

Key Features

  • Core & Architecture  MPC8xx family 32‑bit core with a single processing core implemented at 50 MHz.
  • Performance  50 MHz operating speed suitable for control and communications tasks in embedded systems.
  • Communications Processor (CPM)  Integrated CPM and communications co‑processor resources for protocol offload and serial channel management.
  • Memory Support  Built‑in DRAM controller to interface with external DRAM for system memory needs.
  • Ethernet Connectivity  Multiple Ethernet ports: four 10 Mbps ports plus one 10/100 Mbps port to support diverse network topologies.
  • Serial Protocol Support  Additional interfaces include HDLC/SDLC support for serial link and legacy protocol handling.
  • Power and I/O  3.3 V I/O voltage for compatibility with common embedded peripherals and interfaces.
  • Package & Mounting  357‑PBGA (25×25) supplier device package, surface‑mount mounting type, suitable for compact board designs.
  • Operating Range & Qualification  Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.
  • Architectural Features  Includes memory management units (MMUs) and instruction/data caches as documented for the MPC860 family.

Typical Applications

  • Networking Equipment  Embedded routers, switches or network controllers that require integrated Ethernet ports and CPM‑based protocol handling.
  • Communications Controllers  Devices needing serial protocol support (HDLC/SDLC) and offload capability via the Communications Processor Module.
  • Embedded System Controllers  Compact consumer embedded controllers leveraging the 357‑PBGA package and DRAM interface for system memory.

Unique Advantages

  • Integrated communications engine: The on‑chip Communications Processor Module reduces external component count for protocol processing and serial channel control.
  • Multi‑port Ethernet: Four 10 Mbps ports plus a 10/100 Mbps port provide flexible network connection options without additional PHY aggregation.
  • DRAM controller included: Built‑in memory controller simplifies system memory design and speeds time to prototype.
  • Compact surface‑mount package: 357‑PBGA (25×25) package supports high‑density board layouts for space‑constrained embedded designs.
  • Standard 3.3 V I/O: Ensures compatibility with a wide range of existing embedded peripherals and interface components.
  • RoHS compliant and consumer qualified: Suits consumer‑grade products while meeting environmental compliance requirements.

Why Choose MPC860PVR50D4?

The MPC860PVR50D4 combines a 32‑bit MPC8xx core, integrated CPM, DRAM controller and multiport Ethernet in a single 357‑PBGA surface‑mount package, providing a compact, integrated foundation for communications‑focused embedded designs. Its 3.3 V I/O and consumer qualification make it suitable for a broad range of consumer networking and controller applications.

This part is well suited for engineers and designers building embedded networking equipment or communications controllers that benefit from on‑chip protocol handling, multiple Ethernet interfaces and a straightforward DRAM interface—delivering a balance of integration and predictable operating range for robust, scalable designs.

Request a quote or submit an inquiry to get pricing, availability and lead‑time information for the MPC860PVR50D4.

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