MPC860PCVR66D4

The MPC860PCVR66D4 is a single-core, 32-bit microprocessor from the MPC860 PowerQUICC family, implementing Power Architecture technology. It integrates a communications-oriented processor module and memory controller designed for embedded communications and networking applications.

With a 66 MHz MPC8xx core, integrated CPM co-processor capabilities, multiple Ethernet interfaces and industrial temperature qualification, this device targets embedded systems that require on-chip communications features, DRAM support and robust operation across a wide temperature range.

Key Features

• Processor Core: Single 32-bit MPC8xx core running at 66 MHz, built on Power Architecture technology for embedded control and communications tasks.
• Communications Co-Processor (CPM): Integrated communications processor module (CPM) and communications-oriented co-processor resources for offloading protocol and data-plane functions.
• Memory and Storage: On-chip DRAM controller support to interface with external high-performance DRAM devices.
• Ethernet Connectivity: Multiple Ethernet interfaces including four 10 Mbps ports and one 10/100 Mbps port for networked embedded systems.
• Serial Protocols: Additional HDLC/SDLC interfaces to support common serial communication protocols.
• Power and I/O: 3.3 V I/O voltage compatibility for standard embedded I/O signalling.
• Package and Mounting: 357-PBGA (25×25) supplier device package in a surface-mount form factor for compact board designs.
• Industrial Qualification & Temperature Range: Qualified for industrial use with an operating temperature range of −40 °C to 95 °C.
• Compliance: RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Communications and Networking Equipment: Use the on-chip CPM and multiple Ethernet interfaces for protocol handling, packet processing and network edge devices.
• Industrial Controllers: Industrial-grade operating temperature and DRAM controller support enable reliable control and data acquisition in harsh environments.
• Embedded Networking Modules: Compact 357-PBGA package and integrated communications features make the device suitable for space-constrained embedded network modules.
• Protocol Gateways and Interface Bridges: HDLC/SDLC and CPM resources assist in building protocol conversion, gateway and serial-to-Ethernet bridge solutions.

Unique Advantages

• Integrated Communications Subsystem: Built-in CPM and communications interfaces reduce external component count and simplify board design for networking applications.
• Multiple Ethernet Ports: Native support for several Ethernet interfaces provides flexible connectivity options without additional PHY-heavy designs.
• Industrial-Grade Operation: −40 °C to 95 °C operating range enables deployment in demanding industrial environments.
• Compact Surface-Mount Package: 357-PBGA (25×25) supports compact, high-density PCB layouts for embedded designs.
• 3.3 V I/O Compatibility: Standard I/O voltage eases integration with common peripherals and board-level interfaces.
• RoHS Compliant: Meets lead-free manufacturing requirements for modern electronics production.

Why Choose MPC860PCVR66D4?

The MPC860PCVR66D4 delivers a focused combination of a 32-bit Power Architecture core and integrated communications features targeted at embedded networking and industrial control applications. Its single-core 66 MHz performance, CPM co-processor capabilities, DRAM controller and multi-port Ethernet support provide a compact, integrated platform for protocol handling and networked embedded systems.

Qualified for industrial temperature ranges and supplied in a compact 357-PBGA package with 3.3 V I/O and RoHS compliance, this device is suited for designers seeking a well-documented member of the MPC860 PowerQUICC family with on-chip communications resources and industrial robustness.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the MPC860PCVR66D4. Our team can provide the details you need to evaluate this device for your embedded communications design.