MPC860ENZQ80D4

IC MPU MPC8XX 80MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)

Quantity 1,580 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed80MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860ENZQ80D4 – IC MPU MPC8XX 80MHz 357BGA

The MPC860ENZQ80D4 is a PowerQUICC family microprocessor from NXP Semiconductors based on the MPC8xx core. This single-core, 32-bit device operates at 80 MHz and integrates a communications processor module (CPM) and peripheral functionality targeted at communications and networking systems.

Designed as a one-chip integrated microprocessor and peripheral combination, the MPC860ENZQ80D4 offers on-chip memory management features, DRAM support, and communications interfaces that simplify embedded communications designs while providing consumer-grade qualification and RoHS compliance.

Key Features

  • Core and Performance — MPC8xx 32-bit Power Architecture core running at 80 MHz with on-chip MMUs and instruction/data caches for deterministic embedded processing.
  • Communications Co-processor (CPM) — Integrated CPM for communications-oriented processing and DSP-style communications tasks; CPM includes an inter-integrated controller (I2C) channel.
  • Memory Support — Enhanced memory controller with support for DRAM and high-performance memory types, enabling flexibility in system memory design.
  • Ethernet Connectivity — Ethernet capability indicated as 10Mbps (4), providing built-in networking interface options for communications applications.
  • System Peripherals — Integrated real-time clock and PCMCIA socket controller functionality as described for the MPC860 family.
  • Power and I/O — 3.3 V I/O voltage standard for compatibility with common embedded peripherals and board-level power domains.
  • Package and Mounting — 357-PBGA (25×25) / 357-BBGA package, surface-mount mounting for compact board integration.
  • Operating Range & Compliance — Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
  • Graphics — No graphics acceleration, focused instead on communications and control functionality.

Typical Applications

  • Communications & Networking Equipment — Embedded network controllers and protocol handling where integrated CPM and Ethernet interfaces streamline design.
  • PCMCIA-Enabled Systems — Devices requiring on-chip PCMCIA socket control for removable-media or expansion card support.
  • Embedded Controller Platforms — Single-chip embedded controllers for consumer-grade telecommunications, gateway, or appliance applications leveraging DRAM support and on-chip peripherals.

Unique Advantages

  • Integrated Communications Subsystem — Built-in CPM and communications-focused peripherals reduce external component count for networked designs.
  • Flexible Memory Interface — Enhanced memory controller supports DRAM and higher-performance memory types, simplifying memory selection and scaling.
  • Compact Surface-Mount Package — 357-PBGA (25×25) package enables dense board layouts for space-constrained embedded products.
  • Standardized I/O Voltage — 3.3 V I/O compatibility eases interfacing with common logic families and peripheral devices.
  • Consumer-Grade Qualification and RoHS Compliance — Suitable for consumer product deployments with environmental compliance.

Why Choose MPC860ENZQ80D4?

The MPC860ENZQ80D4 combines a 32-bit Power Architecture MPC8xx core with an integrated communications processor module and a flexible memory controller to deliver a compact, communications-focused microprocessor solution. Its 80 MHz operating speed, on-chip MMUs and caches, and built-in peripherals make it well suited to embedded communications, networking, and PCMCIA-enabled consumer applications.

With a 357-PBGA (25×25) surface-mount package, 3.3 V I/O, and RoHS compliance, this part offers a balanced platform for designs that demand integration, predictable operating range (0 °C to 95 °C), and long-term availability from NXP Semiconductors.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC860ENZQ80D4 and to discuss how it fits your next embedded communications design.

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