OMAP3530DZCBBA
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 720MHz 515-POP-FCBGA (12x12) |
|---|---|
| Quantity | 277 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3530 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C64x+, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 515-POP-FCBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A002A1 TI | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 515-VFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 720MHz | ||
| Supplier Device Package | 515-POP-FCBGA (12×12) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of OMAP3530DZCBBA – IC MPU OMAP-35XX 720MHz 515FCBGA
The OMAP3530DZCBBA is an ARM® Cortex®-A8 microprocessor IC from the Texas Instruments OMAP3530 series. It is a single-core, 32-bit applications processor specified at 720 MHz and designed for embedded and industrial systems.
This device combines a Cortex-A8 core with integrated multimedia and signal-processing capabilities, LPDDR memory controller support, LCD display controller, and multiple USB interfaces, delivering a compact, industrial-grade solution for performance-oriented embedded designs.
Key Features
- Core – ARM® Cortex®-A8 single 32-bit core operating at 720 MHz for general-purpose application processing.
- Co-processors & DSP – Includes signal-processing co-processor capabilities with C64x+ and NEON™ SIMD for multimedia and accelerated data processing.
- Multimedia Acceleration – IVA2.2 accelerator subsystem and POWERVR SGX graphics accelerator support high-performance image, video and graphics processing (as described in OMAP3 series documentation).
- Memory & Display – LPDDR memory controller and LCD display interface controller for modern embedded memory and display subsystems; OMAP3530 devices include a 64K-Byte L2 unified mapped RAM/cache (series documentation).
- Interfaces – Multiple USB ports (three USB 1.x and one USB 2.0) and additional interfaces including HDQ/1-Wire for flexible peripheral connectivity.
- System DMA & Performance – Enhanced DMA architecture (EDMA) and DSP integration for efficient data movement and real-time media processing (features described in series datasheet).
- Package & Mounting – 515-POP-FCBGA (12×12) surface-mount package (515-VFBGA, FCBGA supplier device package), enabling compact board-level integration.
- Industrial Temperature Range – Rated for operation from –40 °C to 105 °C, suitable for industrial environments.
- Compliance – RoHS compliant.
Typical Applications
- Industrial HMI and Control: Drive LCD-based human-machine interfaces and handle application logic and multimedia with integrated display and graphics support.
- Multimedia Devices: Acceleration and DSP support make the device suitable for handhelds or embedded systems that process audio, image, or video streams.
- Embedded Communications: Multiple USB interfaces and HDQ/1-Wire connectivity enable use in communication gateways, data loggers, and instrument control.
- Edge Processing: Single-core ARM processing combined with DSP and SIMD co-processors supports local signal processing and algorithm offload in edge devices.
Unique Advantages
- Single-chip multimedia and processing integration: Cortex-A8 core together with DSP and multimedia accelerators reduces component count and simplifies system design.
- Flexible peripheral connectivity: Multiple USB ports and HDQ/1-Wire support offer broad options for peripherals and sensor interfaces.
- Industrial reliability: –40 °C to 105 °C operating range and surface-mount FCBGA package support deployment in industrial-grade systems.
- Memory and display readiness: LPDDR controller plus LCD controller and on-chip L2 cache support responsive user interfaces and memory bandwidth for media workloads.
- Standards-based multimedia support: NEON SIMD and C64x+ DSP capabilities enable efficient implementation of common multimedia and signal-processing algorithms described in OMAP3 series documentation.
- RoHS compliant: Meets environmental compliance requirements for modern manufacturing.
Why Choose OMAP3530DZCBBA?
The OMAP3530DZCBBA offers a balanced combination of application processing, DSP-assisted multimedia acceleration, and flexible I/O in a compact FCBGA package tailored for embedded and industrial systems. Its 720 MHz Cortex-A8 core and integrated co-processing resources provide a capable platform for designs that require on-device media processing, display control, and robust connectivity.
This part is well suited to engineers building industrial HMIs, multimedia-enabled embedded products, and edge-processing devices that benefit from integrated DSP and graphics acceleration, wide operating temperature capability, and a compact board footprint backed by Texas Instruments OMAP3530 series documentation.
Request a quote or submit a quote today to evaluate the OMAP3530DZCBBA for your next embedded design.

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