OMAP3530DZCBBA

IC MPU OMAP-35XX 720MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 720MHz 515-POP-FCBGA (12x12)

Quantity 277 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3530
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (12x12)
Display & Interface ControllersLCDECCN5A002A1 TIGradeIndustrial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed720MHz
Supplier Device Package515-POP-FCBGA (12×12)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3530DZCBBA – IC MPU OMAP-35XX 720MHz 515FCBGA

The OMAP3530DZCBBA is an ARM® Cortex®-A8 microprocessor IC from the Texas Instruments OMAP3530 series. It is a single-core, 32-bit applications processor specified at 720 MHz and designed for embedded and industrial systems.

This device combines a Cortex-A8 core with integrated multimedia and signal-processing capabilities, LPDDR memory controller support, LCD display controller, and multiple USB interfaces, delivering a compact, industrial-grade solution for performance-oriented embedded designs.

Key Features

  • Core – ARM® Cortex®-A8 single 32-bit core operating at 720 MHz for general-purpose application processing.
  • Co-processors & DSP – Includes signal-processing co-processor capabilities with C64x+ and NEON™ SIMD for multimedia and accelerated data processing.
  • Multimedia Acceleration – IVA2.2 accelerator subsystem and POWERVR SGX graphics accelerator support high-performance image, video and graphics processing (as described in OMAP3 series documentation).
  • Memory & Display – LPDDR memory controller and LCD display interface controller for modern embedded memory and display subsystems; OMAP3530 devices include a 64K-Byte L2 unified mapped RAM/cache (series documentation).
  • Interfaces – Multiple USB ports (three USB 1.x and one USB 2.0) and additional interfaces including HDQ/1-Wire for flexible peripheral connectivity.
  • System DMA & Performance – Enhanced DMA architecture (EDMA) and DSP integration for efficient data movement and real-time media processing (features described in series datasheet).
  • Package & Mounting – 515-POP-FCBGA (12×12) surface-mount package (515-VFBGA, FCBGA supplier device package), enabling compact board-level integration.
  • Industrial Temperature Range – Rated for operation from –40 °C to 105 °C, suitable for industrial environments.
  • Compliance – RoHS compliant.

Typical Applications

  • Industrial HMI and Control: Drive LCD-based human-machine interfaces and handle application logic and multimedia with integrated display and graphics support.
  • Multimedia Devices: Acceleration and DSP support make the device suitable for handhelds or embedded systems that process audio, image, or video streams.
  • Embedded Communications: Multiple USB interfaces and HDQ/1-Wire connectivity enable use in communication gateways, data loggers, and instrument control.
  • Edge Processing: Single-core ARM processing combined with DSP and SIMD co-processors supports local signal processing and algorithm offload in edge devices.

Unique Advantages

  • Single-chip multimedia and processing integration: Cortex-A8 core together with DSP and multimedia accelerators reduces component count and simplifies system design.
  • Flexible peripheral connectivity: Multiple USB ports and HDQ/1-Wire support offer broad options for peripherals and sensor interfaces.
  • Industrial reliability: –40 °C to 105 °C operating range and surface-mount FCBGA package support deployment in industrial-grade systems.
  • Memory and display readiness: LPDDR controller plus LCD controller and on-chip L2 cache support responsive user interfaces and memory bandwidth for media workloads.
  • Standards-based multimedia support: NEON SIMD and C64x+ DSP capabilities enable efficient implementation of common multimedia and signal-processing algorithms described in OMAP3 series documentation.
  • RoHS compliant: Meets environmental compliance requirements for modern manufacturing.

Why Choose OMAP3530DZCBBA?

The OMAP3530DZCBBA offers a balanced combination of application processing, DSP-assisted multimedia acceleration, and flexible I/O in a compact FCBGA package tailored for embedded and industrial systems. Its 720 MHz Cortex-A8 core and integrated co-processing resources provide a capable platform for designs that require on-device media processing, display control, and robust connectivity.

This part is well suited to engineers building industrial HMIs, multimedia-enabled embedded products, and edge-processing devices that benefit from integrated DSP and graphics acceleration, wide operating temperature capability, and a compact board footprint backed by Texas Instruments OMAP3530 series documentation.

Request a quote or submit a quote today to evaluate the OMAP3530DZCBBA for your next embedded design.

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