OMAP3530ECBB72

IC MPU OMAP-35XX 720MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 720MHz 515-POP-FCBGA (12x12)

Quantity 1,725 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3530
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (12x12)
Display & Interface ControllersLCDECCN5A992CGradeCommercial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed720MHz
Supplier Device Package515-POP-FCBGA (12×12)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3530ECBB72 – IC MPU OMAP-35XX 720MHz 515FCBGA

The OMAP3530ECBB72 is an embedded microprocessor IC based on an ARM® Cortex®-A8 core running at 720 MHz. It integrates dedicated signal-processing and multimedia coprocessors along with graphics acceleration and an LCD display controller for display-capable embedded designs.

Designed for embedded applications, this commercial-grade device combines a single 32-bit core, LPDDR memory controller support, multiple USB ports and additional interfaces such as HDQ/1-Wire in a 515-POP-FCBGA (12×12) surface-mount package. It is RoHS compliant and specified for an operating range of 0°C to 90°C.

Key Features

  • Core & Performance — Single ARM® Cortex®-A8 32-bit core clocked at 720 MHz for general-purpose application processing.
  • Signal & Multimedia Coprocessors — Integrated DSP and multimedia engines including C64x+ and NEON™ SIMD to accelerate signal processing and multimedia tasks.
  • Memory Support — LPDDR memory controller support for interfacing with low-power DDR memory devices.
  • Display Subsystem — LCD display interface controller paired with graphics acceleration to drive display-based user interfaces.
  • Connectivity — Multiple USB ports: three USB 1.x ports and one USB 2.0 port, plus HDQ/1-Wire for auxiliary serial communication.
  • Package & Mounting — 515-POP-FCBGA (12×12) supplier device package; 515-VFBGA FCBGA package options; surface-mount mounting type.
  • Commercial Grade & Thermal — Commercial-grade device with an operating temperature range of 0°C to 90°C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Display-equipped Embedded Systems — Use the integrated LCD controller and graphics acceleration to implement user interfaces and graphical displays.
  • Multimedia & Signal Processing Devices — Leverage the C64x+ DSP and NEON™ SIMD coprocessors to offload multimedia and signal-processing workloads.
  • Connected Peripherals — Multiple USB ports and HDQ/1-Wire support enable integration with external devices and sensors requiring USB or serial communication.

Unique Advantages

  • Balanced Processing and Acceleration: A 720 MHz ARM® Cortex®-A8 core combined with dedicated DSP and NEON™ coprocessors provides a mix of general-purpose and accelerated compute for embedded workloads.
  • Integrated Display and Graphics: Built-in LCD controller and graphics acceleration reduce the need for separate display controllers, simplifying BOM and board design for display-capable products.
  • Flexible Connectivity: Multiple USB ports (three USB 1.x and one USB 2.0) plus HDQ/1-Wire support enable diverse peripheral and sensor interfacing options.
  • Compact SMD Package: 515-POP-FCBGA (12×12) surface-mount packaging supports compact PCB layouts for space-constrained embedded designs.
  • Commercial Temperature Range: Rated for operation from 0°C to 90°C to meet typical commercial embedded-environment requirements.
  • RoHS Compliant: Meets RoHS requirements for environmental compliance.

Why Choose OMAP3530ECBB72?

The OMAP3530ECBB72 positions itself as an integrated embedded MPU solution combining a 720 MHz ARM® Cortex®-A8 core with specialized DSP and multimedia coprocessors, graphics acceleration and display support. This combination is suited for engineers designing embedded systems that require on-chip multimedia and display capabilities alongside consolidated peripheral interfaces.

Manufactured by Texas Instruments and delivered in a compact 515-POP-FCBGA (12×12) surface-mount package, the device targets commercial embedded products that benefit from reduced component count, integrated connectivity and a proven silicon vendor.

Request a quote or submit a pricing inquiry to evaluate OMAP3530ECBB72 for your next embedded design and to obtain availability and ordering information.

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