OMAP3530DZCBB

IC MPU OMAP-35XX 600MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 515-POP-FCBGA (12x12)

Quantity 1,093 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3530
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (12x12)
Display & Interface ControllersLCDECCN5A002A1 TIGradeCommercial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed600MHz
Supplier Device Package515-POP-FCBGA (12×12)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3530DZCBB – IC MPU OMAP-35XX 600MHZ 515FCBGA

The OMAP3530DZCBB is a single-core ARM® Cortex®-A8 microprocessor IC running at 600 MHz, designed for embedded microprocessor applications. It combines an ARM Cortex-A8 host core with a high-performance DSP/multimedia subsystem and graphics acceleration to address image, video and audio processing needs in embedded systems.

Targeted at embedded designs that require integrated multimedia capabilities, display support and a rich mix of interfaces, the device delivers system-level integration that simplifies design and reduces component count for commercial-grade products.

Key Features

  • Core — ARM® Cortex®-A8 single core, 32-bit processor running up to 600 MHz for efficient general-purpose processing and control.
  • DSP and SIMD — Integrated C64x+ DSP enhancements and NEON™ SIMD coprocessor for signal processing and multimedia acceleration; supports high-performance image, video and audio operations (IVA2.2 accelerator subsystem).
  • Graphics Acceleration — POWERVR SGX graphics accelerator and a universal scalable shader engine supporting OpenGL ES and OpenVG APIs (series-level feature) to accelerate GUI and 3D workloads.
  • Memory — LPDDR memory controller support and on-chip L1/L2 caches and mapped RAM structures described in the device series, enabling efficient data throughput for multimedia tasks.
  • Interfaces — Multiple USB ports (three USB 1.x and one USB 2.0), LCD display controller and HDQ/1-Wire interface for diverse peripheral connectivity.
  • Package & Mounting — 515-POP-FCBGA (12×12) surface-mount package (515-VFBGA, FCBGA supplier package) for compact board-level integration.
  • Operating Range — Commercial grade operation with an operating temperature range of 0 °C to 90 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Multimedia Devices — Ideal for products requiring image, video and audio acceleration using the IVA2.2 subsystem and DSP/NEON capabilities.
  • Human-Machine Interfaces (HMI) — LCD controller and graphics acceleration enable responsive GUIs and interactive displays in embedded systems.
  • Imaging and Video Processing — DSP and accelerator subsystems support real-time processing tasks in camera and video-oriented applications.
  • Embedded Systems with Rich I/O — Multiple USB ports and HDQ/1-Wire support make the device suitable for embedded platforms requiring diverse peripheral connectivity.

Unique Advantages

  • Highly integrated multimedia platform: Combines ARM Cortex-A8, C64x+ DSP enhancements, IVA2.2 accelerators and POWERVR SGX graphics to consolidate processing and offload media workloads.
  • Heterogeneous processing: ARM core plus DSP and NEON SIMD coprocessor enable task partitioning for efficient real-time and multimedia performance.
  • Rich peripheral set: On-chip LCD controller, multiple USB ports and HDQ/1-Wire provide flexible connectivity options to simplify system design.
  • Compact board footprint: 515-POP-FCBGA (12×12) surface-mount package supports dense integration in space-constrained embedded products.
  • Commercial temperature suitability: Rated for 0 °C to 90 °C operation to meet a wide range of commercial embedded environments.
  • Standards-focused graphics support: Series-level shader and API support helps accelerate GUI and 3D graphics workloads for interactive applications.

Why Choose OMAP3530DZCBB?

The OMAP3530DZCBB positions itself as an embedded multimedia processor that balances general-purpose ARM processing with dedicated DSP and graphics acceleration. Its combination of core performance, on-chip multimedia subsystems and flexible I/O makes it suitable for designers building commercial embedded products that require integrated image, video and audio capabilities.

Backed by Texas Instruments documentation for the OMAP3530 series, this device offers an architecture and feature set aimed at reducing system-level complexity while providing a clear upgrade path for multimedia-centric embedded designs.

Request a quote or submit a purchase inquiry to check availability and pricing for the OMAP3530DZCBB. Our team can provide part availability details and support for your procurement needs.

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