OMAPL138EZWTA3
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16) |
|---|---|
| Quantity | 1,062 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 361-NFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 361-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (1) | Security Features | Boot Security, Cryptography | Speed | 375MHz | ||
| Supplier Device Package | 361-NFBGA (16×16) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL138EZWTA3 – IC MPU OMAP-L1X 375MHz 361-NFBGA
The OMAPL138EZWTA3 is an ARM926EJ-S based microprocessor IC in the OMAP-L13x series from Texas Instruments. It features a single 32-bit core running at 375 MHz with integrated co-processors for signal processing and system control.
Designed for embedded and industrial applications, this device combines compute performance with a broad set of integrated interfaces—Ethernet, SATA, USB and LCD—along with industrial-grade temperature tolerance to support reliable operation in demanding environments.
Key Features
- Core and Performance ARM926EJ-S single-core, 32‑bit processor running at 375 MHz for general-purpose embedded compute tasks.
- Co-Processors Includes a signal-processing co-processor (C674x) and system control co-processor (CP15) to offload specialized workloads.
- Memory Support Built-in SDRAM controller support for external memory interfacing.
- Peripheral Interfaces Integrated connectivity includes 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 + PHY and USB 2.0 + PHY, plus an LCD display controller and HPI interface.
- Security On-chip boot security and cryptography features to support secure boot and data protection functions.
- Package and Mounting Available in a 361‑ball NFBGA supplier package (361‑NFBGA, 16×16) and listed with a 361‑LFBGA case; surface-mount device.
- Industrial Grade Rated for operation from −40 °C to 105 °C to meet industrial temperature requirements.
- Environmental Compliance RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- Industrial Control Leverages the ARM core, DSP co-processor and industrial temperature rating for automation controllers and process monitoring systems.
- Networking and Communications Integrated 10/100 Ethernet and USB interfaces support embedded gateways, managed devices and communication endpoints.
- Storage and Data Interfaces SATA 3 Gbps and USB connectivity enable use in embedded storage controllers and local data acquisition systems.
- Human-Machine Interfaces (HMI) LCD controller and general-purpose interfaces allow implementation of display-driven control panels and operator interfaces.
Unique Advantages
- Integrated Connectivity: Consolidates Ethernet, SATA and USB interfaces on-chip to reduce external component count and simplify board design.
- Dedicated Signal Processing: C674x co-processor enables offloading of DSP tasks for improved system throughput on compute-heavy functions.
- Industrial Temperature Range: −40 °C to 105 °C rating supports deployment in harsh and temperature-variable environments.
- Security Capabilities: Built-in boot security and cryptography features help protect device integrity and sensitive data.
- Compact BGA Package: 361-ball NFBGA (16×16) surface-mount package provides a high-density footprint for space-constrained embedded designs.
- RoHS Compliant: Meets environmental compliance requirements for modern manufacturing processes.
Why Choose OMAPL138EZWTA3?
The OMAPL138EZWTA3 positions itself as a capable embedded application processor combining a 375 MHz ARM926EJ-S core with DSP offload, a comprehensive set of on-chip interfaces and industrial-grade reliability. As part of the Texas Instruments OMAP-L13x series, it offers a balanced mix of integration and performance for engineers developing embedded systems that require networking, storage, display and secure boot capabilities.
This device is well suited for design teams targeting industrial control, communications, storage interface and HMI applications who need a single-chip solution that reduces board complexity while supporting extended temperature operation and environmental compliance.
Request a quote or contact sales to discuss availability, pricing and lead times for OMAPL138EZWTA3 and to obtain additional ordering information.

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