OMAPL138EZWTA3E

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16)

Quantity 1,269 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed375MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138EZWTA3E – IC MPU OMAP-L1X 375MHZ 361NFBGA

The OMAPL138EZWTA3E is an ARM926EJ-S based microprocessor from the Texas Instruments OMAP-L13x series, delivering a single 32-bit core at 375 MHz. Designed for embedded applications, it integrates a range of system and peripheral interfaces to support networking, storage, display and secure boot use cases.

As an industrial-grade device rated from -40°C to 105°C, this MPU targets embedded systems that require integrated I/O, security features, and a compact surface-mount package for space-constrained designs.

Key Features

  • Core  ARM926EJ-S single 32-bit core running at 375 MHz for general-purpose embedded processing.
  • Co-processors  Includes signal processing co-processor C674x and system control CP15 to offload specialized tasks.
  • Memory Support  SDRAM controller on-chip to interface with external SDRAM memory.
  • Display  Integrated LCD controller for direct connection to display panels and user interfaces.
  • Ethernet  10/100 Mbps Ethernet interface suitable for networked embedded devices.
  • SATA  SATA 3 Gbps interface for storage and media applications.
  • USB  Both USB 1.1 and USB 2.0 interfaces with PHYs included to simplify USB connectivity.
  • Additional Interfaces  Host Port Interface (HPI) for parallel host communication.
  • Security  Built-in boot security and cryptography features to support secure system boot and data protection.
  • Package & Mounting  361-ball LFBGA / 361-NFBGA (16×16) surface-mount package for compact board designs.
  • Industrial Grade  Operating temperature range of -40°C to 105°C for deployment in industrial environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Embedded Systems  Use in control and monitoring equipment where industrial temperature range and integrated I/O reduce component count.
  • Networking Equipment  Embedded routers and network appliances leveraging the 10/100 Mbps Ethernet interface.
  • Storage and Media Gateways  Devices that require SATA 3 Gbps connectivity for local storage and media handling.
  • Human-Machine Interfaces (HMI)  Display-driven embedded applications using the integrated LCD controller and USB connectivity for peripherals.
  • Secure Embedded Devices  Products that require boot security and cryptographic functions to protect firmware and data.

Unique Advantages

  • Integrated processing and co-processing: Single ARM926EJ-S core combined with C674x co-processor and CP15 simplifies partitioning of control and signal-processing tasks.
  • Broad peripheral set: On-chip Ethernet, SATA, USB 1.1/2.0 with PHYs, LCD controller and HPI reduce external component count and simplify board design.
  • Industrial temperature rating: -40°C to 105°C capability supports deployment in harsh or temperature-variable environments.
  • Security features included: Boot security and cryptography capability help protect device integrity and stored data.
  • Compact BGA package: 361-ball NFBGA (16×16) surface-mount package enables high-density, space-saving PCB layouts.
  • Regulatory compliance: RoHS compliance supports environmentally conscious design and manufacturing.

Why Choose OMAPL138EZWTA3E?

The OMAPL138EZWTA3E combines a 375 MHz ARM926EJ-S core with dedicated co-processing and a wide set of integrated interfaces to address embedded designs that need networking, storage, display and security capabilities in a single device. Its industrial temperature rating and compact 361-ball BGA package make it suitable for space-constrained and harsh-environment applications.

Backed by the Texas Instruments OMAP-L13x series, the device is positioned for engineers seeking a tightly integrated microprocessor solution that balances processing, peripheral integration and system-level security for long-lived embedded products.

Request a quote or submit a procurement inquiry for the OMAPL138EZWTA3E to discuss availability, pricing, and lead times for your project requirements.

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