OMAPL138EZWTA3E
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16) |
|---|---|
| Quantity | 1,269 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 361-NFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 361-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (1) | Security Features | Boot Security, Cryptography | Speed | 375MHz | ||
| Supplier Device Package | 361-NFBGA (16×16) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL138EZWTA3E – IC MPU OMAP-L1X 375MHZ 361NFBGA
The OMAPL138EZWTA3E is an ARM926EJ-S based microprocessor from the Texas Instruments OMAP-L13x series, delivering a single 32-bit core at 375 MHz. Designed for embedded applications, it integrates a range of system and peripheral interfaces to support networking, storage, display and secure boot use cases.
As an industrial-grade device rated from -40°C to 105°C, this MPU targets embedded systems that require integrated I/O, security features, and a compact surface-mount package for space-constrained designs.
Key Features
- Core ARM926EJ-S single 32-bit core running at 375 MHz for general-purpose embedded processing.
- Co-processors Includes signal processing co-processor C674x and system control CP15 to offload specialized tasks.
- Memory Support SDRAM controller on-chip to interface with external SDRAM memory.
- Display Integrated LCD controller for direct connection to display panels and user interfaces.
- Ethernet 10/100 Mbps Ethernet interface suitable for networked embedded devices.
- SATA SATA 3 Gbps interface for storage and media applications.
- USB Both USB 1.1 and USB 2.0 interfaces with PHYs included to simplify USB connectivity.
- Additional Interfaces Host Port Interface (HPI) for parallel host communication.
- Security Built-in boot security and cryptography features to support secure system boot and data protection.
- Package & Mounting 361-ball LFBGA / 361-NFBGA (16×16) surface-mount package for compact board designs.
- Industrial Grade Operating temperature range of -40°C to 105°C for deployment in industrial environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Embedded Systems Use in control and monitoring equipment where industrial temperature range and integrated I/O reduce component count.
- Networking Equipment Embedded routers and network appliances leveraging the 10/100 Mbps Ethernet interface.
- Storage and Media Gateways Devices that require SATA 3 Gbps connectivity for local storage and media handling.
- Human-Machine Interfaces (HMI) Display-driven embedded applications using the integrated LCD controller and USB connectivity for peripherals.
- Secure Embedded Devices Products that require boot security and cryptographic functions to protect firmware and data.
Unique Advantages
- Integrated processing and co-processing: Single ARM926EJ-S core combined with C674x co-processor and CP15 simplifies partitioning of control and signal-processing tasks.
- Broad peripheral set: On-chip Ethernet, SATA, USB 1.1/2.0 with PHYs, LCD controller and HPI reduce external component count and simplify board design.
- Industrial temperature rating: -40°C to 105°C capability supports deployment in harsh or temperature-variable environments.
- Security features included: Boot security and cryptography capability help protect device integrity and stored data.
- Compact BGA package: 361-ball NFBGA (16×16) surface-mount package enables high-density, space-saving PCB layouts.
- Regulatory compliance: RoHS compliance supports environmentally conscious design and manufacturing.
Why Choose OMAPL138EZWTA3E?
The OMAPL138EZWTA3E combines a 375 MHz ARM926EJ-S core with dedicated co-processing and a wide set of integrated interfaces to address embedded designs that need networking, storage, display and security capabilities in a single device. Its industrial temperature rating and compact 361-ball BGA package make it suitable for space-constrained and harsh-environment applications.
Backed by the Texas Instruments OMAP-L13x series, the device is positioned for engineers seeking a tightly integrated microprocessor solution that balances processing, peripheral integration and system-level security for long-lived embedded products.
Request a quote or submit a procurement inquiry for the OMAPL138EZWTA3E to discuss availability, pricing, and lead times for your project requirements.

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