OMAPL138EZCEQ4R

PROTOTYPE
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (13x13)

Quantity 315 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature–Package / Case361-LFBGARAM ControllersDDR2, LPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesBoot Security, CryptographySpeed456MHzSupplier Device Package361-NFBGA (13×13)
USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138EZCEQ4R – PROTOTYPE

The OMAPL138EZCEQ4R PROTOTYPE from Texas Instruments is an embedded microprocessor solution that pairs an ARM926EJ-S RISC processor running at up to 456 MHz with a C674x signal-processing co‑processor. It targets embedded designs that require a combination of general-purpose control and dedicated DSP signal processing, with integrated memory controllers and multiple high‑speed interfaces.

Designed for compact system integration, the device provides flexible memory support, a broad set of peripheral interfaces and hardware security features, all in a 361‑ball NFBGA (13×13) package for surface-mount applications.

Key Features

  • Core Architecture ARM926EJ‑S RISC processor up to 456 MHz paired with a C674x fixed‑ and floating‑point VLIW DSP co‑processor for dedicated signal processing tasks.
  • Memory and Cache On‑chip shared memory and support for DDR2 and LPDDR memory controllers enable flexible external memory configurations.
  • External Memory Interfaces EMIFA support for NOR/NAND and a DDR2/mDDR memory controller provide options for both parallel and mobile DDR memory types.
  • High‑Speed Connectivity Integrated 10/100 Mbps Ethernet controller and a SATA 3 Gbps interface enable wired networking and storage connectivity.
  • USB and Peripheral I/O USB 1.1 and USB 2.0 controllers each with PHY, plus UART, SPI and HPI interfaces for a wide range of peripheral connectivity and host communications.
  • Display and Multimedia Integrated LCD controller supports display interface needs for embedded HMI applications.
  • Security Features Boot security and cryptography features support secure boot and data protection mechanisms.
  • Package and Mounting 361‑ball NFBGA (13×13) supplier device package / 361‑LFBGA case, surface mount.
  • I/O Voltage Options 1.8 V or 3.3 V LVCMOS I/Os (except USB and DDR2 interfaces), allowing flexible system-level voltage planning.
  • Standards and Compliance RoHS compliant.

Typical Applications

  • Embedded Control Systems Use the ARM926EJ‑S core for general control, system management and application logic in compact embedded products.
  • Signal Processing Platforms Leverage the C674x DSP co‑processor for compute‑intensive signal processing workloads alongside the ARM control plane.
  • Networked and Storage Devices Integrate 10/100 Mbps Ethernet and SATA 3 Gbps interfaces for connected embedded appliances and local storage solutions.
  • Human‑Machine Interfaces Drive LCD displays and manage user interfaces while handling background processing and communications.

Unique Advantages

  • Combined MCU and DSP Capabilities: A programmable ARM core plus a dedicated C674x DSP co‑processor enable partitioning of control and intensive signal processing tasks within a single device.
  • Flexible Memory Support: DDR2 and LPDDR memory controller support plus EMIFA for NOR/NAND provides designers multiple memory architecture choices to match capacity and cost targets.
  • Integrated High‑Speed I/O: Built-in Ethernet, SATA and USB interfaces reduce external component count and simplify board design for networked and storage applications.
  • Hardware Security: Boot security and cryptography features provide system-level protection for secure boot and data handling.
  • Compact Surface‑Mount Package: 361‑ball NFBGA (13×13) packaging supports dense board layouts while maintaining robust connectivity.
  • Vendor Documentation and Ecosystem: Device details and technical documentation are available from the manufacturer to support development and integration.

Why Choose OMAPL138EZCEQ4R?

OMAPL138EZCEQ4R offers a balanced embedded processing platform by combining a 456 MHz ARM926EJ‑S core with a C674x DSP co‑processor, integrated memory controllers, and a comprehensive set of high‑speed interfaces. This combination suits projects that require both control and signal processing within a compact, surface‑mount package.

The device is well suited to design teams building embedded systems that need scalable processing, secure boot capability, and multiple connectivity options, while benefiting from Texas Instruments’ technical documentation and ecosystem support for development and production.

Request a quote or submit an inquiry today to discuss availability, pricing, and lead times for the OMAPL138EZCEQ4R PROTOTYPE.

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