OMAPL138EZCEA3R

The OMAPL138EZCEA3R is an ARM926EJ‑S microprocessor IC from the OMAP‑L13x series, featuring a single 32‑bit core running at 375 MHz in a 361‑NFBGA (13×13) surface‑mount package. It is specified for industrial‑grade operation and RoHS compliance.

Designed for embedded applications that require integrated connectivity, storage and security capabilities, this device combines a general‑purpose ARM core with DSP coprocessor support, multiple high‑speed interfaces and onboard system controllers to simplify system design in industrial and embedded products.

Key Features

• Core & Performance  ARM926EJ‑S single 32‑bit core operating at 375 MHz, providing deterministic embedded processing.
• Coprocessors  Includes support for signal‑processing coprocessor C674x and system control coprocessor CP15 to extend processing capabilities.
• Memory Support  Onboard SDRAM controller for external memory interfacing to support application and system software needs.
• Storage & Connectivity  Integrated interfaces include 10/100Mbps Ethernet (1), SATA 3Gbps (1), USB 1.1 + PHY (1) and USB 2.0 + PHY (1) to enable networked, storage and peripheral connectivity.
• Display & Host Interface  LCD display controller and additional HPI interface for display and host processor connectivity.
• Security & Reliability  Built‑in boot security and cryptography features to support secure system boot and basic cryptographic functions.
• Package & Mounting  Supplied in a 361‑NFBGA (13×13) surface‑mount package suitable for compact board designs.
• Industrial Temperature Range  Specified operating temperature from −40 °C to 105 °C and designated as an industrial‑grade device.
• Environmental Compliance  RoHS compliant for environmentally conscious designs.

Typical Applications

• Industrial Automation  Use in embedded controllers and automation nodes that require industrial temperature operation together with Ethernet connectivity.
• Embedded Storage & Gateway Devices  SATA 3Gbps and Ethernet interfaces enable deployment in compact storage gateways and networked appliances.
• Human‑Machine Interfaces (HMI)  LCD controller and HPI support integration into operator panels and display‑driven embedded systems.
• Connectivity‑Focused Embedded Systems  Combined USB (1.1 and 2.0) and Ethernet support for peripherals, communications and data transfer tasks.

Unique Advantages

• Integrated I/O Suite: Consolidates Ethernet, SATA and dual USB PHYs on a single device to reduce external components and simplify BOM.
• Industrial‑Grade Reliability: Operates over −40 °C to 105 °C, making it suitable for temperature‑challenging embedded environments.
• Security Built In: Boot security and cryptography features help protect system startup and sensitive operations without extra external security ICs.
• Extended Processing Capability: ARM926EJ‑S core plus C674x DSP coprocessor support enables flexible allocation of control and signal‑processing tasks.
• Compact, Surface‑Mount Package: 361‑NFBGA (13×13) package allows dense board layouts for space‑constrained designs.
• Standards‑Oriented Interfaces: Inclusion of SATA 3Gbps and 10/100 Ethernet supports common storage and networking standards for interoperability.

Why Choose OMAPL138EZCEA3R?

The OMAPL138EZCEA3R positions itself as a practical, industrial‑grade embedded processor that balances single‑core ARM performance with a broad set of integrated interfaces and security features. Its combination of Ethernet, SATA, USB and display support, along with SDRAM controller and DSP coprocessor capability, makes it well suited for embedded applications that need connectivity, storage and deterministic control in a compact package.

As part of the OMAP‑L13x series, this device targets engineers and procurement teams designing robust, long‑lifecycle products where temperature range, RoHS compliance and integration level drive value through reduced BOM complexity and simplified system architecture.

Request a quote or submit an inquiry to get pricing and availability for the OMAPL138EZCEA3R and discuss how it fits your embedded design requirements.