OMAPL138EZCE3

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13)

Quantity 968 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed375MHz
Supplier Device Package361-NFBGA (13×13)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138EZCE3 – ARM926EJ-S 375MHz MPU, 361‑NFBGA

The OMAPL138EZCE3 is an ARM926EJ-S based 32-bit microprocessor operating at 375 MHz, designed for embedded applications requiring integrated peripheral connectivity and security features. It combines a general-purpose ARM926EJ-S core with co-processor support to address signal-processing and system-control tasks within a single-package solution.

Targeted for commercial embedded systems, the device integrates interfaces for networking, storage and host connectivity while providing boot security and cryptography options. The 361‑pin NFBGA (13×13) package and 0 °C to 90 °C operating range make it suitable for a broad set of industrial and consumer embedded designs.

Key Features

  • Processor Core – ARM926EJ-S single core, 32‑bit architecture running at 375 MHz for general-purpose embedded processing.
  • Co‑processors – Includes signal-processing support via C674x and system control via CP15 to offload specialized tasks.
  • Memory and Display – SDRAM controller support and an LCD display interface controller for typical embedded memory and HMI needs.
  • Wired Networking – Integrated 10/100 Mbps Ethernet interface for network connectivity.
  • Storage Interface – Built‑in SATA 3 Gbps interface to support local high-speed storage solutions.
  • USB Connectivity – On-chip USB 1.1 and USB 2.0 controllers, each with PHY, for host and device connection flexibility.
  • System Interfaces – Additional HPI (Host Port Interface) for external host or accelerator attachment.
  • Security – Boot security and cryptography features to support secure boot and data protection workflows.
  • Package and Mounting – 361‑NFBGA (13×13) supplier device package, surface-mount mounting type, listed as 361‑LFBGA package case variant.
  • Commercial Grade and Temperature – Commercial grade device rated for operation from 0 °C to 90 °C.
  • Compliance – RoHS compliant.

Typical Applications

  • Industrial Control – Use the ARM926EJ-S core with SDRAM and HPI to run control firmware and interface with external accelerators or I/O.
  • Networked Embedded Systems – Leverage the integrated 10/100 Mbps Ethernet and USB interfaces for connected devices or gateway endpoints.
  • Storage-Enabled Products – Employ the SATA 3 Gbps interface for embedded storage controllers or media appliances requiring local disk connectivity.
  • HMI and Display Devices – Drive LCD panels directly via the LCD display interface controller for human-machine interfaces and control panels.

Unique Advantages

  • Integrated High-Speed Interfaces: Built‑in Ethernet, SATA and USB (1.1 and 2.0) reduce external component count and simplify board-level design for connectivity and storage.
  • Co-processor Support: C674x DSP support and CP15 system control enable offloading of signal-processing and system tasks for improved workload partitioning.
  • Security-Ready: On-chip boot security and cryptography features enable secure firmware deployment and data protection strategies.
  • Compact BGA Package: 361‑pin NFBGA (13×13) surface-mount package provides a dense footprint suitable for space-constrained embedded systems.
  • Commercial Temperature Range: Rated 0 °C to 90 °C to meet a wide range of commercial embedded deployment environments.
  • Standards Compliance: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose OMAPL138EZCE3?

The OMAPL138EZCE3 positions itself as a versatile embedded processor combining an ARM926EJ-S core with dedicated co-processor support and a broad set of integrated interfaces. Its mix of Ethernet, SATA and USB connectivity, together with SDRAM controller and LCD support, makes it well suited for designs that require networking, storage and human‑machine interaction in a compact package.

This device is ideal for engineers and procurement teams targeting commercial-grade embedded products who need a single-chip solution that balances processing capability, peripheral integration and on-chip security features while remaining compliant with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for OMAPL138EZCE3 and to discuss your volume and delivery requirements.

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