OMAPL138BZWTRB

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16)

Quantity 170 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersDDR2, LPDDRREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed375MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138BZWTRB – IC MPU OMAP-L1X 375MHz 361-NFBGA

The OMAPL138BZWTRB is an embedded microprocessor device featuring an ARM926EJ-S 32-bit core operating at 375 MHz with a C674x signal-processing co-processor and system-control CP15. Designed for embedded applications, the device combines processor performance with integrated memory controllers and a broad set of peripheral interfaces to support connectivity, storage and display functions in commercial-grade systems.

With on-chip security features and multiple external memory and I/O options, this device targets embedded designs that require a balance of compute and system integration for industrial, communications and consumer-focused applications.

Key Features

  • Core and DSP  ARM926EJ-S 32-bit core at 375 MHz with a C674x signal-processing co-processor (DSP) and CP15 system control functionality.
  • Processor memory architecture  ARM memory includes 16KB instruction cache, 16KB data cache, 8KB RAM for vector table and 64KB ROM as documented in the device datasheet.
  • On-chip RAM and DSP memory  128KB of shared RAM is available for system and DSP use per the datasheet extract.
  • External memory support  DDR2 and LPDDR memory controllers plus EMIFA for NOR/NAND and 16-bit SDRAM interfaces enable flexible external memory configurations.
  • Interfaces — connectivity and storage  Integrated 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 + PHY and USB 2.0 + PHY provide wired networking and storage connectivity options.
  • Display and host interfaces  LCD controller and HPI (Host Port Interface) for display and host communication needs.
  • High-performance DMA  Enhanced DMA controller (EDMA3) with multiple channels and transfer controllers as described in the datasheet to support high-throughput data movement.
  • Security features  Boot security and cryptography support for system-level protection.
  • Package and mounting  361-ball LFBGA / 361-NFBGA (16 × 16) surface-mount package.
  • Operating range & compliance  Commercial grade with operating temperature range 0 °C to 90 °C and RoHS-compliant status.
  • Software support  Datasheet documents software support including TI DSP BIOS, Chip Support Library and DSP Library for development and integration.

Typical Applications

  • Industrial Control  Use the ARM core plus DSP co-processor for real-time control, signal processing and connected monitoring while leveraging DDR2/LPDDR memory interfaces for application storage.
  • Networked Storage and NAS  Integrated SATA 3 Gbps and 10/100 Ethernet provide a foundation for compact network-attached storage and media appliances.
  • Human-Machine Interfaces  LCD controller, USB interfaces and HPI support display-driven user interfaces and host communications in embedded systems.
  • Communications and Gateway Devices  Ethernet, USB and rich DMA capability enable data movement and protocol processing in embedded gateways and communication modules.

Unique Advantages

  • Combined MPU and DSP capability:  ARM926EJ-S plus C674x DSP co-processor provide deterministic control and high-throughput signal processing in a single device.
  • Integrated system interfaces:  On-chip Ethernet, SATA and USB interfaces reduce external components and simplify system-level design for connectivity and storage.
  • Flexible memory options:  Support for DDR2 and LPDDR plus EMIFA for NOR/NAND and SDRAM allows designers to tailor memory architecture to application needs.
  • Security primitives on-chip:  Boot security and cryptography features help implement secure boot flows and basic runtime protection.
  • Package and thermal suitability for commercial products:  361-ball NFBGA surface-mount package and 0 °C to 90 °C operating range align with commercial embedded product requirements.
  • Development ecosystem:  Documented support with TI DSP BIOS and libraries streamlines software development and integration.

Why Choose OMAPL138BZWTRB?

The OMAPL138BZWTRB positions itself as a flexible embedded processor solution combining an ARM926EJ-S general-purpose core with a C674x DSP co-processor, on-chip security, and a broad set of memory and I/O interfaces. These integrated capabilities reduce system complexity while providing the processing resources needed for mixed control, signal-processing and connectivity workloads.

This device is suited to engineers building commercial embedded systems that require integrated storage and network interfaces, display support and DSP-accelerated processing, backed by documented software libraries and development support from the device documentation.

Request a quote or submit a parts inquiry to check availability and pricing for OMAPL138BZWTRB for your next embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1930


    Headquarters: Dallas, Texas, USA


    Employees: 34,000+


    Revenue: $17.52 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up