OMAPL138BZWTA3R

The OMAPL138BZWTA3R is an industrial-grade embedded microprocessor built around a 32-bit ARM926EJ-S core running at 375 MHz. It combines an ARM application core with a C674x signal-processing co-processor and a broad set of system interfaces to support demanding embedded designs.

Designed for embedded applications, the device delivers a compact, integrated platform that pairs real-time signal processing capability with peripheral-rich connectivity—making it suitable where compute, storage, and communications interfaces must coexist in a single package.

Key Features

• Core & DSP  ARM926EJ-S 32-bit processor at 375 MHz with a C674x signal-processing co-processor for DSP-class workloads and system control (CP15).
• Memory Architecture  On-chip caches and memory include 16KB instruction cache, 16KB data cache, an 8KB vector table RAM and 64KB of ROM; C674x DSP memory architecture includes 32KB L1P and 32KB L1D with a 256KB L2 unified mapped RAM/cache (as provided in the series datasheet).
• DMA & Shared Memory  Enhanced DMA controller (EDMA3) with multiple transfer controllers, up to 64 independent DMA channels and flexible transfer/burst sizing for efficient data movement.
• Display & HPI  Integrated LCD display controller and HPI interface for host parallel connectivity and display-driven embedded user interfaces.
• Storage & Connectivity  Integrated SATA 3 Gbps port and a 10/100 Mbps Ethernet MAC for storage and networking applications.
• USB  Includes USB 1.1 with PHY and USB 2.0 with PHY to support a range of peripheral and host connectivity options.
• Security  Boot security and cryptography features to support secure boot and basic on-device cryptographic functions.
• Packaging & Mounting  361-pin NFBGA (16×16 mm) surface-mount package; supplier device package listed as 361-NFBGA / 361-LFBGA.
• Operating Range & Compliance  Industrial-grade device rated for operation from –40 °C to 105 °C and RoHS compliant.
• Software Ecosystem (Series)  Series-level software support includes TI DSP/BIOS, chip support libraries and DSP libraries to accelerate application development (as noted in the series datasheet).

Typical Applications

• Industrial Control & Automation  Use the ARM core and C674x DSP to handle control algorithms and signal processing while leveraging Ethernet and robust I/O for field connectivity.
• Networking & Communications Appliances  10/100 Ethernet and multiple USB interfaces enable embedded routers, gateways or protocol converters with local processing.
• Storage Gateways  Integrated SATA 3 Gbps combined with DMA support makes the device suitable for compact storage controllers and media servers.
• Human‑Machine Interfaces (HMIs)  LCD controller and HPI support for display and user-interface tasks alongside application processing and secure boot capabilities.

Unique Advantages

• Integrated ARM + DSP Architecture:  Combines an ARM926EJ-S application core with a C674x DSP co-processor to consolidate control and signal-processing tasks on a single device, reducing system complexity.
• Broad Peripheral Set:  On-chip SATA, Ethernet, USB 1.1/2.0, LCD and HPI interfaces reduce external component count and simplify board-level integration.
• Deterministic DMA and Memory:  EDMA3 with up to 64 channels and flexible RAM/cache partitioning enables efficient data movement and predictable performance for real-time workloads.
• Industrial Temperature Range & RoHS Compliance:  Rated for –40 °C to 105 °C and RoHS compliant, supporting deployment in industrial environments with regulatory compliance for lead-free assembly.
• Proven Software Support:  Series-level support such as TI DSP/BIOS and DSP/Chip Support Libraries accelerates development and enables reuse of reference software components.

Why Choose OMAPL138BZWTA3R?

OMAPL138BZWTA3R positions itself as a compact, industrial-grade embedded processor that balances general-purpose ARM processing with dedicated DSP capability and a rich set of system interfaces. Its integrated SATA, Ethernet and USB peripherals, together with on-chip caches, DMA and software support, make it a practical choice for designs that require mixed application and signal-processing workloads in a single package.

This device is suited to engineers and product teams building embedded systems that need moderate CPU performance, real-time signal processing, and extensive I/O while maintaining a small BOM and industrial temperature operation. The combination of integration, software ecosystem, and robust thermal range supports long-term deployment in industrial and embedded applications.

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