OMAPL138BZWT3

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16)

Quantity 1,787 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C – 90°CPackage / CaseTray
Speed375MHzVoltage1.8V, 3.3V

Overview of OMAPL138BZWT3 – IC MPU OMAP-L1X 375MHZ 361NFBGA

The OMAPL138BZWT3 is a 32-bit microprocessor IC based on the ARM926EJ-S core running at 375 MHz, packaged in a 361‑pin NFBGA (16 × 16) surface‑mount package. It combines an ARM926EJ‑S application processor with a high‑performance TMS320C674x signal‑processing DSP architecture and a broad set of on‑chip system interfaces.

Targeted at embedded designs that require CPU/DSP processing, rich peripherals and integrated I/O, this device delivers system-level integration for applications needing real‑time signal processing, storage and network connectivity while reducing board BOM and interface bridging.

Key Features

  • Processing Cores  ARM926EJ‑S 32‑bit RISC MPU at 375 MHz paired with a C674x fixed‑ and floating‑point VLIW DSP core for signal processing tasks.
  • Memory and Caches  Multi‑level on‑chip memory including ARM caches and DSP RAM: examples in the series include 16KB instruction and 16KB data caches, 32KB L1 program/data RAM for DSP, and 256KB L2 unified mapped RAM/cache plus 128KB shared RAM.
  • High‑speed I/O and Storage  Integrated interfaces include 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 and USB 2.0 with PHYs, and an LCD display controller for system and user‑interface connectivity.
  • External Memory Support  Two external memory interfaces: EMIFA for NOR/NAND and support for 16‑bit SDRAM, plus a DDR2/Mobile DDR memory controller supporting expanded address spaces.
  • DMA and System Peripherals  Enhanced EDMA3 controller with extensive channel support (including 64 independent DMA channels and 16 QDMA channels) for high‑throughput data movement and low CPU overhead.
  • Security  On‑chip security features for boot security and cryptography to support secure system boot and data protection.
  • Packaging and Mounting  361‑NFBGA (16×16) surface‑mount package optimized for high‑density board designs.

Typical Applications

  • Industrial Control & Automation  Real‑time control and signal processing using the combined ARM and C674x DSP resources, with Ethernet connectivity for networked systems.
  • Multimedia & Imaging Appliances  DSP acceleration for audio, imaging and other signal‑processing pipelines alongside an ARM application processor for system control and HMI tasks with the LCD controller.
  • Storage and Data Recording  Integrated SATA 3 Gbps and USB interfaces enable local mass‑storage, logging and data‑acquisition systems requiring sustained throughput.
  • Communication Gateways  Ethernet and USB connectivity combined with DSP processing make the device suitable for protocol processing, packet handling and edge compute nodes.

Unique Advantages

  • Integrated ARM + DSP Processing:  Combines a 375 MHz ARM926EJ‑S MPU with a C674x DSP core to consolidate application control and heavy signal processing in a single device, reducing BOM and board complexity.
  • Comprehensive I/O Suite:  On‑chip Ethernet, SATA, USB 1.1/2.0 with PHYs and LCD controller provide direct connectivity for networking, storage and user interfaces without multiple external controllers.
  • High‑performance Data Movement:  EDMA3 with dozens of DMA and QDMA channels offloads copy and transfer work from processors, enabling efficient real‑time data paths.
  • Flexible Memory Architecture:  Multiple cache and RAM levels plus external memory interfaces (EMIFA, SDRAM, DDR2/Mobile DDR) support a wide range of application memory footprints and performance profiles.
  • Built‑in Security Features:  Boot security and cryptography capabilities help protect system integrity and sensitive data at power‑up and runtime.
  • Software and Library Support:  Series documentation indicates availability of TI DSP/BIOS and DSP libraries to accelerate development and algorithm deployment.

Why Choose OMAPL138BZWT3?

The OMAPL138BZWT3 positions itself as a highly integrated MPU/DSP solution for embedded designs that demand both application control and intensive signal processing. Its 375 MHz ARM926EJ‑S core combined with the C674x DSP architecture, comprehensive peripheral set (Ethernet, SATA, USB, LCD) and a robust DMA/memory subsystem deliver a compact platform for industrial, multimedia and communication products.

Designers benefit from the on‑chip security features, flexible external memory support and software resources indicated for the series, enabling scalable development and system robustness while minimizing external component count and board complexity.

Request a quote or submit an inquiry to receive pricing, availability and technical assistance for incorporating OMAPL138BZWT3 into your next embedded design.

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