OMAPL138BZCED4

The OMAPL138BZCED4 is an industrial-grade embedded microprocessor featuring an ARM926EJ‑S 32‑bit core running at 456 MHz combined with a C674x signal-processing coprocessor. It combines real-time processing capability and optimized DSP performance in a single 361‑NFBGA (13×13) surface‑mount package.

Designed for embedded and industrial applications, this device targets systems that require integrated communications, storage and display interfaces along with hardware security and robust memory subsystem support.

Key Features

• Core and DSP One ARM926EJ‑S 32‑bit core at 456 MHz paired with a C674x fixed/floating‑point DSP for signal processing acceleration and mixed workload support.
• Processor Memory Architecture ARM9 memory architecture with 16KB instruction cache and 16KB data cache; C674x two‑level cache architecture including 32KB L1P, 32KB L1D and a 256KB L2 unified mapped RAM/cache, plus 128KB shared RAM as described in the device family datasheet.
• Memory Interfaces Dedicated SDRAM controller support plus external memory interfaces (EMIFA) for NOR/NAND and a DDR2/Mobile DDR memory controller as detailed in the product family documentation.
• High‑speed Connectivity Integrated 10/100 Mbps Ethernet (1), SATA 3 Gbps (1), USB 2.0 + PHY and USB 1.1 + PHY, and an LCD controller for display subsystems.
• Peripheral and Host Interfaces Host Port Interface (HPI) and a broad peripheral set suited for embedded I/O integration.
• DMA and System Throughput Enhanced EDMA3 controller with multiple transfer controllers and up to 64 independent DMA channels to accelerate memory‑to‑memory and peripheral transfers.
• Security Boot security and cryptography features to support secure boot and embedded security functions.
• Industrial Grade Packaging and Temperature 361‑NFBGA (13×13) package, surface‑mount mounting, and an operating temperature range of −40 °C to 90 °C. RoHS compliant.

Typical Applications

• Industrial Embedded Systems Multi‑function controllers and monitoring units that benefit from combined ARM control and DSP acceleration for real‑time processing tasks.
• Networking and Communications Devices requiring 10/100 Ethernet and flexible DMA for packet handling and protocol processing.
• Storage and Gateway Devices Systems leveraging the integrated SATA 3 Gbps interface for local storage or embedded gateway applications.
• Human‑Machine Interfaces (HMI) Display‑driven embedded products using the integrated LCD controller alongside general I/O and USB connectivity.

Unique Advantages

• Highly integrated DSP+ARM solution: Combines an ARM926EJ‑S application core with a C674x DSP to consolidate control and signal processing workloads on a single chip, reducing component count.
• Broad I/O and storage connectivity: Native support for Ethernet, SATA, USB and LCD interfaces enables compact designs with extensive peripheral connectivity.
• Robust memory subsystem: EMIFA and DDR2/Mobile DDR support plus a two‑level cache architecture enable high throughput and flexible memory configurations.
• Accelerated data movement: EDMA3 with numerous channels and transfer controllers reduces CPU overhead for bulk data transfers.
• Industrial readiness: Wide operating temperature range (−40 °C to 90 °C) and RoHS compliance make the device suitable for industrial deployments.
• Software ecosystem support: Family datasheet cites TI software components such as TI DSP/BIOS, Chip Support Library and DSP libraries to accelerate development and integration.

Why Choose OMAPL138BZCED4?

The OMAPL138BZCED4 positions itself as a performance‑oriented, highly integrated processor for embedded and industrial designs that require a balance of real‑time control and DSP capability. Its combination of an ARM926EJ‑S core, C674x DSP, comprehensive memory interfaces and rich peripheral set delivers a compact platform for designs that must handle communications, storage and display tasks.

This device is well suited to engineers building rugged, long‑life embedded systems who need proven silicon with a documented software ecosystem and robust I/O options. The integrated security features, industrial temperature range and surface‑mount BGA package further support deployment in demanding environments.

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