OMAPL138BZCEA3R

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13)

Quantity 100 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed375MHz
Supplier Device Package361-NFBGA (13×13)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138BZCEA3R – IC MPU OMAP-L1X 375MHZ 361NFBGA

The OMAPL138BZCEA3R is a 32-bit embedded microprocessor featuring an ARM926EJ-S core running at 375 MHz and an on-chip C674x signal-processing co-processor. Designed for embedded and industrial systems, this device integrates a broad set of interfaces and memory controllers to support communications, storage, human‑machine interfaces, and real‑time signal processing.

This industrial-grade device delivers integrated I/O (Ethernet, SATA, USB), display support, SDRAM and NAND/NOR memory interfaces, and security features such as boot security and cryptography, all in a compact 361‑NFBGA (13×13) surface-mount package rated from -40°C to 105°C.

Key Features

  • Processor Core  ARM926EJ-S 32-bit core at 375 MHz with ARM Jazelle support and EmbeddedICE-RT real-time debug capabilities.
  • Signal-Processing Co-processor  Integrated C674x DSP support for high-performance signal processing tasks and system control via CP15.
  • Memory Architecture  On-chip memory and cache architecture includes L1/L2 options and shared RAM; external memory support includes SDRAM, DDR2/Mobile DDR via memory controllers and EMIFA for NOR/NAND devices.
  • High-Speed Interfaces  10/100 Mbps Ethernet, SATA 3 Gbps port, and both USB 1.1 and USB 2.0 with PHYs provide versatile connectivity for networking and storage applications.
  • Display & Host I/O  Integrated LCD controller and Host Port Interface (HPI) enable user-interface and host communication designs.
  • DMA and Data Movement  Enhanced DMA (EDMA3) with multiple transfer controllers, independent channels and quick-DMA channels to optimize high-throughput peripherals and memory transfers.
  • Security & System Control  Built-in boot security and cryptography capabilities support secure boot and protected operation modes.
  • Package & Environmental  361‑lead NFBGA (13×13) surface-mount package; industrial temperature rating from -40°C to 105°C; RoHS compliant.

Typical Applications

  • Industrial Control & Automation  Real-time control and signal processing in harsh environments using on-chip DSP acceleration and industrial temperature rating.
  • Networking & Communications  Gateways and managed devices leveraging 10/100 Mbps Ethernet, USB 2.0, and SATA connectivity for data transfer and storage.
  • Human‑Machine Interfaces (HMI)  Local display and interface controllers enable compact operator panels and embedded GUI systems with direct LCD support.
  • Signal Processing & Instrumentation  DSP‑accelerated analytics and waveform processing for measurement equipment and specialized embedded instruments.

Unique Advantages

  • Highly Integrated I/O  Ethernet, SATA, USB 1.1/2.0 with PHYs, LCD controller and HPI reduce external component count and simplify board-level design.
  • On-chip DSP Acceleration  C674x signal-processing co-processor provides dedicated compute for DSP tasks while freeing the ARM core for control and system management.
  • Robust Memory Subsystem  Flexible L1/L2 cache and on-chip/shared RAM combined with SDRAM and DDR2 controllers support high-throughput and low-latency memory access patterns.
  • Industrial Temperature Range  Rated from -40°C to 105°C for deployment in demanding environments where extended operating ranges are required.
  • Security Features  Boot security and cryptography capabilities help protect system integrity and support secure deployment scenarios.
  • Software Support  Series-level software resources include TI DSP/BIOS and chip support libraries to accelerate development and integration.

Why Choose OMAPL138BZCEA3R?

OMAPL138BZCEA3R combines an ARM926EJ-S control processor with a C674x signal-processing co-processor and a broad set of integrated peripherals to deliver a compact, industrial-grade platform for embedded designs that require both control and DSP capability. Its integrated interfaces—Ethernet, SATA, USB, LCD, and flexible memory controllers—make it suitable for systems that demand connectivity, storage, and user interfaces within a single package.

With RoHS compliance, on-chip security features, extensive DMA and memory architecture, and available software support, this device targets engineers building robust, scalable embedded solutions for industrial, communications, HMI, and instrumentation applications.

Request a quote or submit a parts inquiry to evaluate OMAPL138BZCEA3R for your next embedded design project.

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