OMAPL138BZCE3
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13) |
|---|---|
| Quantity | 570 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM926EJ-S | Device Package | 361-NFBGA (13x13) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C – 90°C | Package / Case | Tray | ||
| Speed | 375MHz | Voltage | 1.8V, 3.3V |
Overview of OMAPL138BZCE3 – IC MPU OMAP-L1X 375MHZ 361NFBGA
The OMAPL138BZCE3 is a 32-bit embedded microprocessor IC built around a 375 MHz ARM926EJ-S core, paired with a C674x-class signal-processing co-processor. It targets embedded applications that require a balanced combination of general-purpose control and DSP-class signal processing in a single, highly integrated device.
With on-chip interfaces for Ethernet, SATA and USB, alongside display support and integrated security features, the device is suited to embedded control, communications and storage-aware systems where integration, peripheral breadth and software support matter.
Key Features
- Processor and DSP ARM926EJ-S 32‑bit processor core running at 375 MHz, with a C674x-class DSP co-processor for signal-processing tasks.
- Memory architecture ARM9 memory architecture with 16 KB instruction and 16 KB data caches, 8 KB vector RAM and 64 KB ROM. C674x two-level cache with 32 KB L1P, 32 KB L1D and a 256 KB L2 unified mapped RAM/cache plus 128 KB shared RAM.
- External memory support EMIFA for NOR/NAND (8- or 16-bit data), 16-bit SDRAM support and a DDR2/mobile DDR memory controller with support up to a 256‑MB address space.
- High-throughput peripherals Integrated 10/100 Mbps Ethernet (1), SATA 3 Gbps (1), and both USB 1.1 + PHY and USB 2.0 + PHY interfaces for broad connectivity and storage options.
- Display support On-chip LCD display controller for embedded user-interface implementations.
- DMA and transfer engines (EDMA3) Enhanced DMA controller with up to 64 independent DMA channels and 16 QDMA channels for efficient data movement and reduced CPU overhead.
- Security Built-in boot security and cryptography features to support secure boot and encrypted operations.
- Packaging and mounting 361‑ball NFBGA (13 × 13 mm) supplier device package, surface-mount, tray packaging suitable for volume assembly.
- Software support Software ecosystem includes TI DSP/BIOS, Chip Support Library and DSP library support as documented for the OMAP-L138 series.
Typical Applications
- Embedded control systems Use the ARM926EJ-S core for control and system management while leveraging the C674x DSP for compute‑intensive signal processing tasks.
- Networked appliances Integrated 10/100 Mbps Ethernet and USB interfaces make the part suitable for connected gateway and appliance designs requiring moderate networking throughput.
- Storage and media appliances SATA 3 Gbps combined with USB and DMA resources supports embedded storage controllers, media appliances and devices needing local storage interfaces.
- Human‑machine interfaces On-chip LCD controller and embedded memory/cache resources enable compact implementations of operator displays and control panels.
Unique Advantages
- Balanced ARM + DSP integration: Combines a 375 MHz ARM926EJ-S application core with a C674x DSP co-processor to consolidate control and signal-processing workloads on one chip, reducing system BOM and board complexity.
- Broad peripheral set: Native Ethernet, SATA and multiple USB PHYs provide flexible options for networking, storage and peripheral connectivity without many external controllers.
- Rich memory subsystem: Multi-level caches, unified L2 RAM/cache and shared RAM improve data throughput and deterministic performance for mixed-control and DSP tasks.
- High-efficiency data movement: EDMA3 with numerous DMA/QDMA channels offloads data transfers from the CPU and DSP, improving overall system efficiency.
- Built-in security primitives: Boot security and cryptography features enable secure device provisioning and protected operation where required.
- Proven software libraries: Availability of TI DSP/BIOS, Chip Support Library and DSP libraries facilitates development and accelerates time to market.
Why Choose OMAPL138BZCE3?
OMAPL138BZCE3 positions itself as an integrated solution for embedded designs that need a combination of general-purpose processing and DSP-level signal processing, paired with a wide set of on-chip peripherals for networking, storage and display. Its memory architecture, DMA capabilities and software support make it well suited to designs that require efficient data movement and mixed workloads.
This device is appropriate for developers and OEMs building embedded controllers, networked appliances, storage-aware systems and HMI products that benefit from a single-chip approach to reduce component count and simplify system design while leveraging available TI software libraries for accelerated development.
Request a quote or submit your requirements to receive pricing and availability information for the OMAPL138BZCE3. Our team will provide a tailored response to support your design and procurement needs.

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