OMAPL138BGWTMEP

IC MPU OMAP-L1X 345MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 345MHz 361-NFBGA (16x16)

Quantity 856 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A001A2CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-55°C ~ 125°C (TJ)Package / Case361-LFBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesBoot Security, CryptographySpeed345MHzSupplier Device Package361-NFBGA (16×16)
USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138BGWTMEP – IC MPU OMAP-L1X 345MHZ 361NFBGA

The OMAPL138BGWTMEP is an ARM926EJ-S based microprocessor IC in the OMAP-L13x series, delivering a single 32‑bit core at 345 MHz in a 361‑ball NFBGA (16×16) package. Designed for embedded applications, it integrates a range of system interfaces and on‑chip coprocessor support to address connectivity, storage and control use cases.

Key Features

  • Processor Core  ARM926EJ-S single 32‑bit core running at 345 MHz for general embedded processing tasks.
  • Coprocessors  Includes signal processing coprocessor C674x and system control coprocessor CP15 to support specialized processing and control functions.
  • Memory and Display  SDRAM controller for external memory interfacing and an LCD display controller for local display connectivity.
  • Connectivity  Integrated 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 with PHY and USB 2.0 with PHY provide a broad set of wired I/O options.
  • Security  On‑chip boot security and cryptography features to support secure boot and data protection workflows.
  • Additional Interfaces  Host Port Interface (HPI) included for expanded peripheral connectivity.
  • Package and Assembly  361‑ball LFBGA package (supplier device package: 361‑NFBGA, 16×16) and surface‑mount mounting for compact board designs.
  • Operating Range  Rated for operation from -55°C to 125°C for use in wide‑temperature environments.
  • Graphics  No dedicated graphics acceleration on this device.

Typical Applications

  • Embedded Control Systems  Use the ARM926EJ-S core and coprocessor support for control and signal processing tasks in embedded controllers.
  • Networking Equipment  Leverage the integrated 10/100 Mbps Ethernet interface for basic network connectivity and communication functions.
  • Storage and NAS Devices  SATA 3 Gbps support enables integration into storage subsystems and network‑attached storage designs.
  • Human‑Machine Interfaces  LCD display controller and USB interfaces support local user interfaces and peripheral connectivity.

Unique Advantages

  • Integrated I/O Suite: Combines Ethernet, SATA, USB 1.1/2.0 with PHY and LCD controller to reduce external interface components.
  • Specialized Coprocessor Support: C674x signal‑processing coprocessor and CP15 system control coprocessor provide hardware support for targeted processing tasks.
  • Wide Operating Temperature: Rated from -55°C to 125°C for deployment in applications requiring extended temperature tolerance.
  • On‑Chip Security: Boot security and cryptography features enable implementation of secure boot and data protection functions.
  • Compact Surface‑Mount Package: 361‑ball NFBGA (16×16) package supports space‑constrained board layouts while providing many I/O options.
  • SDRAM Support: On‑chip SDRAM controller simplifies external memory interfacing for system designs.

Why Choose OMAPL138BGWTMEP?

OMAPL138BGWTMEP positions itself as a compact, interface‑rich embedded microprocessor combining an ARM926EJ‑S core with dedicated coprocessor support, multiple wired connectivity options and on‑chip security. It is suited for designs that require a balance of processing capability, integrated I/O and robust operating temperature range.

This device is appropriate for engineers and system designers implementing embedded controllers, networked devices, storage interfaces or HMI solutions who need explicit interface integration, SDRAM support and a surface‑mount BGA package for dense board layouts.

Request a quote or submit an inquiry to begin procurement or to discuss volume pricing and availability for the OMAPL138BGWTMEP.

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