OMAPL138AZCE3

IC MPU OMAP-L1X 300MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 300MHz 361-NFBGA (13x13)

Quantity 449 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed300MHz
Supplier Device Package361-NFBGA (13×13)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138AZCE3 – IC MPU OMAP-L1X 300MHZ 361NFBGA

The OMAPL138AZCE3 is a 32-bit embedded microprocessor IC based on the ARM926EJ-S core running at 300 MHz in a 361‑NFBGA (13×13) package. It combines an ARM926EJ-S application processor with a C674x signal-processing co-processor and a broad set of peripheral interfaces to address embedded applications that require integrated connectivity, storage and display support.

Designed for commercial-grade deployments, this device provides on-chip memory/controller support, security features for protected boot and cryptography, and industrially relevant interfaces such as Ethernet, SATA and USB—making it suitable for compact, surface‑mount system designs operating between 0 °C and 90 °C.

Key Features

  • Core and Signal Processing ARM926EJ-S 32‑bit processor core at 300 MHz with an integrated C674x signal-processing co-processor for dedicated DSP workloads.
  • Memory and External Interfaces On-chip SDRAM controller support and series-level external memory interfaces (EMIFA, NOR/NAND, DDR2/mDDR referenced in the OMAP‑L138 family) for flexible memory configurations.
  • High‑Speed I/O Integrated 10/100 Mbps Ethernet, SATA 3 Gbps port, USB 1.1 + PHY and USB 2.0 + PHY along with an LCD display controller for networking, storage and HMI connectivity.
  • Peripheral and System Interfaces Additional interfaces include HPI, UARTs and SPIs (series-level UART and SPI support described for the OMAP‑L138 family), simplifying sensor and peripheral integration.
  • On-Chip DMA and Performance Optimizations Enhanced DMA capabilities and multi-level cache/RAM architecture described for the OMAP‑L138 series provide efficient data movement and reduced CPU overhead for real-time tasks.
  • Security Boot security and cryptography features provide foundational device security for protected boot and secure operations.
  • Package, Mounting and Environmental 361‑NFBGA (13×13) supplier device package, surface-mount mounting type, commercial grade, RoHS compliant, and an operating temperature range of 0 °C to 90 °C.
  • Graphics Graphics acceleration is not included; the device provides an LCD controller for display output.

Typical Applications

  • Industrial Control Real-time control and signal processing using the ARM926EJ-S core with the C674x co-processor and on-chip DMA to handle sensor data and control loops.
  • Networked Embedded Storage Devices requiring network connectivity and local storage can leverage the integrated 10/100 Ethernet interface and SATA 3 Gbps support for compact NAS or gateway designs.
  • Human-Machine Interfaces Embedded systems with local displays benefit from the built-in LCD controller along with USB connectivity for peripherals and input devices.
  • Connectivity Hubs and Gateways Integration of Ethernet, multiple USB PHYs and additional serial interfaces makes this part suitable for communication gateways and protocol bridging applications.

Unique Advantages

  • Integrated DSP Acceleration: The presence of a C674x signal-processing co-processor offloads compute-intensive tasks from the ARM core, enabling efficient handling of signal and media algorithms.
  • Broad, System-Level I/O: Built-in Ethernet, SATA and dual USB PHYs reduce external components and simplify PCB design for connected embedded products.
  • Security-Ready Boot: Boot security and cryptography features support protected system start-up and secure storage of critical assets.
  • Compact, Surface-Mount Package: The 361‑NFBGA (13×13) package delivers high pin density in a compact footprint suitable for space-constrained embedded designs.
  • Commercial-Grade Reliability: Rated for 0 °C to 90 °C operation and RoHS compliance, helping meet commercial deployment and regulatory supply-chain requirements.

Why Choose OMAPL138AZCE3?

The OMAPL138AZCE3 positions itself as a versatile embedded MPU for designs that require a balanced combination of application processing, signal-processing capability and extensive peripheral support. With a 300 MHz ARM926EJ-S core, a C674x DSP co-processor, hardware security features and integrated high-speed interfaces, it suits compact systems that demand integrated connectivity and storage without extensive external logic.

This device is ideal for engineers and procurement teams building commercial‑grade embedded products—offering a compact BGA package, surface-mount compatibility and the peripheral mix needed to streamline BOM and accelerate time to market while relying on documented series-level memory and DMA capabilities.

Request a quote or submit your project requirements to receive pricing and availability information for the OMAPL138AZCE3. Our team can provide delivery lead times and help match device quantities to your production schedule.

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