OMAPL137DZKBD4

IC MPU OMAP-L1X 456MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 256-BGA (17x17)

Quantity 300 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed456MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137DZKBD4 – IC MPU OMAP-L1X 456MHz 256-BGA

The OMAPL137DZKBD4 is an industrial-grade microprocessor IC in the OMAP-L13x series from Texas Instruments. It integrates a single ARM926EJ-S 32-bit core running at 456 MHz and a set of on-chip controllers and interfaces aimed at embedded designs.

With integrated Ethernet, SATA, USB, LCD controller support, SDRAM memory controller and on-chip security features, this device targets embedded industrial applications that require a compact, surface-mount MPU in a 256-ball BGA (17×17) package.

Key Features

  • Core & Performance  ARM926EJ-S processor core, single 32‑bit core running at 456 MHz for deterministic embedded processing.
  • Co-processors  Includes signal processing co-processor C674x and system control co-processor CP15 for offloading specialized tasks.
  • Memory & Display  SDRAM controller on-chip and LCD display interface controller support for embedded memory and display subsystems.
  • High-speed Interfaces  Integrated 10/100 Mbps Ethernet interface and HPI for host parallel interface connectivity.
  • Storage & USB  Built-in SATA 3 Gbps port plus USB 2.0 + PHY and USB 1.1 + PHY for storage and peripheral connectivity.
  • Security & System Control  Boot security and cryptography features included to support secure boot and data protection workflows.
  • Package & Mounting  256‑BGA (17×17) supplier device package, surface-mount mounting type for compact PCB designs.
  • Grade & Temperature Range  Industrial grade device rated for operation from −40 °C to 90 °C.
  • Compliance  RoHS compliant.
  • Graphics Acceleration  No graphics acceleration.

Typical Applications

  • Industrial Control  Industrial-grade temperature range and integrated I/O (Ethernet, HPI, USB) make the device suited for embedded control and automation systems.
  • Networking and Communication Appliances  On-chip 10/100 Mbps Ethernet and system control co-processor support networked embedded nodes and communications equipment.
  • Storage and Media Gateways  SATA 3 Gbps plus USB 2.0 connectivity enable use in compact storage controllers and media gateway applications.
  • Human-Machine Interfaces  SDRAM controller and LCD display interface controllers allow implementation of embedded user interfaces with local display support.

Unique Advantages

  • Compact, industry-grade package: 256‑BGA (17×17) surface-mount package provides a small footprint while meeting industrial temperature requirements (−40 °C to 90 °C).
  • Integrated storage and peripheral I/O: Built-in SATA 3 Gbps and dual USB PHYs reduce external component count for storage and peripheral connectivity.
  • Network-ready connectivity: On-chip 10/100 Mbps Ethernet simplifies integration into networked embedded systems.
  • On-chip security features: Boot security and cryptography support help protect firmware and data at system startup and runtime.
  • Dedicated co-processor support: C674x signal processing and CP15 system control co-processors enable task offload for specialized processing without adding discrete devices.
  • RoHS compliant: Meets RoHS environmental compliance requirements for regulated markets.

Why Choose OMAPL137DZKBD4?

The OMAPL137DZKBD4 positions itself as a compact, industrial-grade MPU that combines a 456 MHz ARM926EJ-S core with a broad set of integrated interfaces and on-chip security. Its mix of Ethernet, SATA, USB, SDRAM controller and display interface capability makes it well suited for embedded designs that require connectivity, storage, and secure boot functionality in a single device.

Designed and manufactured by Texas Instruments as part of the OMAP-L13x series, this device is appropriate for engineering teams building industrial embedded systems, networked appliances, storage gateways, and HMI devices that need a deterministic single-core MPU with integrated peripheral support and industrial temperature operation.

Request a quote or submit your specifications to receive pricing and availability for the OMAPL137DZKBD4.

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