OMAPL137DZKBA3

The OMAPL137DZKBA3 is a single-core microprocessor IC based on the ARM926EJ-S architecture, running at 375 MHz. Designed for embedded and industrial applications, it integrates a broad set of peripheral controllers and security capabilities to support networked, storage and human-machine interface designs.

As a member of the OMAP-L13x series from Texas Instruments, this device combines a 32-bit core with SDRAM and display controllers, multiple high-speed I/O options, and industrial temperature rating for deployment in robust systems.

Key Features

• Core ARM926EJ-S single 32-bit core operating at 375 MHz, delivering deterministic processing for embedded control tasks.
• Memory and Display Integrated SDRAM controller and LCD display interface controller for direct connection to memory and simple display subsystems.
• High-speed Interfaces On-chip 10/100 Mbps Ethernet, SATA 3 Gbps interface, and both USB 1.1 and USB 2.0 with PHY support provide flexible connectivity options for networking and storage.
• Co-processors Includes signal-processing co-processor support (C674x) and system control coprocessor (CP15) to offload specialized tasks.
• Additional Interfaces Host Port Interface (HPI) for parallel host communication and other peripheral interfacing.
• Security Built-in boot security and cryptography features to support secure boot and data protection architectures.
• Package and Mounting 256-ball BGA (17 × 17 mm) surface-mount package optimized for compact board designs.
• Industrial Temperature Range Rated for operation from −40 °C to 105 °C for deployment in industrial environmental conditions.
• Compliance RoHS compliant to support environmentally conscious manufacturing requirements.

Typical Applications

• Industrial Embedded Systems — Controls and monitors where industrial temperature range and integrated I/O reduce system-level complexity.
• Networking and Communication Appliances — 10/100 Mbps Ethernet and USB interfaces enable networked edge devices and connectivity modules.
• Storage and Media Gateway Devices — SATA 3 Gbps and USB 2.0 interfaces support local storage and media streaming applications.
• Human-Machine Interfaces (HMIs) — LCD controller and HPI support user interface control and peripheral interaction in operator panels.

Unique Advantages

• Integrated I/O Suite: Combines Ethernet, SATA, USB 1.1/2.0 (with PHY), LCD and HPI on a single device to reduce BOM and simplify board design.
• Security-Ready: On-chip boot security and cryptography capabilities enable secure system startup and data protection strategies.
• Industrial Grade Operation: −40 °C to 105 °C rating supports deployment in demanding environments where thermal resilience is required.
• Compact BGA Package: 256-BGA (17 × 17 mm) surface-mount package helps minimize PCB footprint for space-constrained designs.
• Dedicated Co-processor Support: Signal-processing and system-control co-processor options allow offloading specialized workloads for more efficient processing.
• RoHS Compliance: Environmentally compliant manufacturing support for contemporary supply chains.

Why Choose OMAPL137DZKBA3?

The OMAPL137DZKBA3 positions itself as a highly integrated microprocessor solution for embedded and industrial designs that require a balanced combination of processing, connectivity and security. Its 375 MHz ARM926EJ-S core, multiple integrated high-speed interfaces, and industrial temperature rating make it suitable for systems where integration and environmental robustness are priorities.

This device is well suited for engineers and procurement teams building networked gateways, storage-enabled appliances, HMIs and other embedded platforms that demand secure boot capability, compact packaging and a broad set of on-chip peripherals drawn from the OMAP-L13x series.

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