OMAPL137CZKBT3
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17) |
|---|---|
| Quantity | 1,151 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 256-BGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Automotive | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 256-BGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 375MHz | Supplier Device Package | 256-BGA (17×17) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL137CZKBT3 – IC MPU OMAP-L1X 375MHZ 256BGA
The OMAPL137CZKBT3 is a single-core ARM926EJ-S microprocessor running at 375 MHz, packaged in a 256-ball BGA (17×17). It integrates a 32-bit core with dedicated co-processor support and a range of high-speed interfaces, making it suitable for embedded designs that require moderate processing performance with multiple connectivity options.
Key on-chip capabilities include signal-processing co-processor support, SDRAM memory controller, LCD display controller, and a comprehensive set of I/O interfaces for networking, storage and USB connectivity, all specified with an extended operating temperature range.
Key Features
- Core & Performance — ARM926EJ-S single 32-bit core operating at 375 MHz for deterministic embedded processing.
- Co-processors — Signal processing support via C674x and system control through CP15 to offload specialized tasks from the main core.
- Memory & Display — Integrated SDRAM controller and LCD display controller for managing external memory and driving visual interfaces.
- Connectivity & Storage — Built-in 10/100 Mbps Ethernet port, one SATA 3 Gbps interface, one USB 1.1 + PHY and one USB 2.0 + PHY for flexible networking and storage topologies.
- Peripheral Interfaces — Host Port Interface (HPI) and other system I/O to connect external peripherals and controllers.
- Security Features — On-chip boot security and cryptography features to support secure boot and data protection functions.
- Package & Mounting — 256-ball BGA package (17×17) designed for surface-mount assembly.
- Operating Range — Rated for operation from −40 °C to 125 °C to support deployments across wide temperature environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Embedded Networking & Storage Controllers — Systems that require 10/100 Mbps Ethernet alongside SATA 3 Gbps for data transfer and local storage management.
- Human-Machine Interfaces (HMI) — Devices that use the integrated LCD controller and SDRAM interface to drive displays and manage UI memory.
- USB-Enabled Embedded Devices — Products requiring both USB 1.1 and USB 2.0 connectivity with onboard PHY support for peripheral and host roles.
- Signal Processing Applications — Designs that leverage the C674x signal-processing co-processor for dedicated computation tasks alongside the ARM926EJ-S core.
Unique Advantages
- Integrated multi-protocol I/O: On-chip Ethernet, SATA and dual USB PHYs reduce external components and simplify system-level integration.
- Dedicated co-processor support: C674x and CP15 offload specialized processing and system control functions to improve task separation and efficiency.
- Wide operating temperature: −40 °C to 125 °C rating supports deployment in temperature-challenging environments.
- Security-ready hardware: Built-in boot security and cryptography enable hardware-based protection for device integrity and data confidentiality.
- Compact BGA package: 256-ball, 17×17 surface-mount package enables high-density board designs while maintaining a broad set of interfaces.
Why Choose OMAPL137CZKBT3?
The OMAPL137CZKBT3 positions a balanced combination of a 375 MHz ARM926EJ-S core with dedicated co-processor resources and a comprehensive set of connectivity options. It is well suited for embedded systems that need moderate processing performance, on-chip networking and storage interfaces, and hardware security features within a compact BGA footprint.
Designers targeting systems that require multiple high-speed interfaces, display support, and operation across a wide temperature range will find the OMAPL137CZKBT3 a focused option that consolidates functionality to help streamline board-level design and reduce external component count.
Request a quote or submit an inquiry for pricing and availability of the OMAPL137CZKBT3 to discuss lead times and volume pricing.

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