OMAPL137CZKB3
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17) |
|---|---|
| Quantity | 689 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 256-BGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Commercial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 90°C (TJ) | Package / Case | 256-BGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 375MHz | Supplier Device Package | 256-BGA (17×17) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL137CZKB3 – IC MPU OMAP-L1X 375MHz 256-BGA
The OMAPL137CZKB3 is an ARM926EJ-S microprocessor IC from the Texas Instruments OMAP-L13x series, delivering a single 32-bit core running at 375 MHz in a 256-ball BGA (17×17) package. Designed for embedded, commercial-grade applications, it integrates a range of system interfaces and controllers to support networked and storage-capable embedded systems.
With on-chip controllers for SDRAM and LCD, integrated Ethernet, SATA and USB PHYs, plus security features and DSP co-processing support, the device targets embedded designs that require balanced processing performance combined with peripheral integration.
Key Features
- Core ARM926EJ-S single 32-bit core operating at 375 MHz for deterministic embedded processing.
- Co-processors Includes a C674x signal-processing co-processor and CP15 system control co-processor to offload specialized tasks.
- Memory & Controllers SDRAM controller on-chip to interface with external SDRAM subsystems.
- Display Integrated LCD display interface controller for embedded user interfaces.
- Connectivity Integrated 10/100 Mbps Ethernet port and SATA 3 Gbps interface for network and storage connectivity.
- USB Includes both USB 1.1 + PHY and USB 2.0 + PHY to support a range of USB peripheral options.
- Additional Interfaces Host Port Interface (HPI) available for external device communication.
- Security Built-in boot security and cryptography features to support secure boot and data protection workflows.
- Package & Mounting 256-BGA (17×17) surface-mount package suitable for compact embedded boards.
- Operational Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 90 °C.
- Environmental Compliance RoHS compliant.
- Graphics No graphics acceleration included.
Typical Applications
- Embedded Networking Devices — Systems requiring integrated 10/100 Mbps Ethernet for connectivity and data exchange.
- Storage-Enabled Embedded Systems — Designs that leverage the on-chip SATA 3 Gbps interface for attached storage solutions.
- USB Peripheral Controllers — Products utilizing USB 1.1 and USB 2.0 PHYs for peripheral connectivity and data I/O.
- User Interface Controllers — Embedded HMIs and display-driven devices making use of the LCD controller.
- Signal Processing Offload — Applications that benefit from the C674x DSP co-processor for dedicated signal-processing tasks.
Unique Advantages
- Integrated Peripheral Set: Built-in Ethernet, SATA, USB PHYs, LCD controller and SDRAM controller reduce external component count and simplify BOM.
- Balanced Processing: ARM926EJ-S core at 375 MHz provides predictable, single-core performance for embedded control tasks.
- DSP Offload Capability: C674x co-processor enables dedicated signal-processing workloads without occupying the main CPU core.
- Security Features Included: On-chip boot security and cryptography support secure system initialization and data protection.
- Compact Surface-Mount Package: 256-BGA (17×17) packaging supports space-constrained board layouts while enabling standard surface-mount assembly.
- Commercial Temperature Range: Rated for 0 °C to 90 °C to meet typical commercial embedded operating environments.
Why Choose OMAPL137CZKB3?
The OMAPL137CZKB3 positions itself as a commercially graded, integrated microprocessor solution in the Texas Instruments OMAP-L13x family, combining a 375 MHz ARM926EJ-S core with on-chip peripherals for networking, storage, USB and display interfaces. Its DSP co-processor and security features enable mixed control and signal-processing workloads while preserving system-level integration.
This device is well suited for embedded product designs that require a compact BGA package, a comprehensive peripheral set, and secure boot/cryptography capabilities. As a part of the OMAP-L13x series from Texas Instruments and RoHS compliant, it offers an integration-focused option for commercial embedded implementations.
Request a quote to check availability and pricing for the OMAPL137CZKB3 or submit a quote inquiry to begin evaluating this integrated microprocessor for your embedded design needs.

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