OMAPL137CZKB3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 689 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137CZKB3 – IC MPU OMAP-L1X 375MHz 256-BGA

The OMAPL137CZKB3 is an ARM926EJ-S microprocessor IC from the Texas Instruments OMAP-L13x series, delivering a single 32-bit core running at 375 MHz in a 256-ball BGA (17×17) package. Designed for embedded, commercial-grade applications, it integrates a range of system interfaces and controllers to support networked and storage-capable embedded systems.

With on-chip controllers for SDRAM and LCD, integrated Ethernet, SATA and USB PHYs, plus security features and DSP co-processing support, the device targets embedded designs that require balanced processing performance combined with peripheral integration.

Key Features

  • Core ARM926EJ-S single 32-bit core operating at 375 MHz for deterministic embedded processing.
  • Co-processors Includes a C674x signal-processing co-processor and CP15 system control co-processor to offload specialized tasks.
  • Memory & Controllers SDRAM controller on-chip to interface with external SDRAM subsystems.
  • Display Integrated LCD display interface controller for embedded user interfaces.
  • Connectivity Integrated 10/100 Mbps Ethernet port and SATA 3 Gbps interface for network and storage connectivity.
  • USB Includes both USB 1.1 + PHY and USB 2.0 + PHY to support a range of USB peripheral options.
  • Additional Interfaces Host Port Interface (HPI) available for external device communication.
  • Security Built-in boot security and cryptography features to support secure boot and data protection workflows.
  • Package & Mounting 256-BGA (17×17) surface-mount package suitable for compact embedded boards.
  • Operational Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 90 °C.
  • Environmental Compliance RoHS compliant.
  • Graphics No graphics acceleration included.

Typical Applications

  • Embedded Networking Devices — Systems requiring integrated 10/100 Mbps Ethernet for connectivity and data exchange.
  • Storage-Enabled Embedded Systems — Designs that leverage the on-chip SATA 3 Gbps interface for attached storage solutions.
  • USB Peripheral Controllers — Products utilizing USB 1.1 and USB 2.0 PHYs for peripheral connectivity and data I/O.
  • User Interface Controllers — Embedded HMIs and display-driven devices making use of the LCD controller.
  • Signal Processing Offload — Applications that benefit from the C674x DSP co-processor for dedicated signal-processing tasks.

Unique Advantages

  • Integrated Peripheral Set: Built-in Ethernet, SATA, USB PHYs, LCD controller and SDRAM controller reduce external component count and simplify BOM.
  • Balanced Processing: ARM926EJ-S core at 375 MHz provides predictable, single-core performance for embedded control tasks.
  • DSP Offload Capability: C674x co-processor enables dedicated signal-processing workloads without occupying the main CPU core.
  • Security Features Included: On-chip boot security and cryptography support secure system initialization and data protection.
  • Compact Surface-Mount Package: 256-BGA (17×17) packaging supports space-constrained board layouts while enabling standard surface-mount assembly.
  • Commercial Temperature Range: Rated for 0 °C to 90 °C to meet typical commercial embedded operating environments.

Why Choose OMAPL137CZKB3?

The OMAPL137CZKB3 positions itself as a commercially graded, integrated microprocessor solution in the Texas Instruments OMAP-L13x family, combining a 375 MHz ARM926EJ-S core with on-chip peripherals for networking, storage, USB and display interfaces. Its DSP co-processor and security features enable mixed control and signal-processing workloads while preserving system-level integration.

This device is well suited for embedded product designs that require a compact BGA package, a comprehensive peripheral set, and secure boot/cryptography capabilities. As a part of the OMAP-L13x series from Texas Instruments and RoHS compliant, it offers an integration-focused option for commercial embedded implementations.

Request a quote to check availability and pricing for the OMAPL137CZKB3 or submit a quote inquiry to begin evaluating this integrated microprocessor for your embedded design needs.

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