OMAPL137BZKBT3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 284 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137BZKBT3 – IC MPU OMAP-L1X 375MHZ 256BGA

The OMAPL137BZKBT3 is an ARM926EJ-S microprocessor IC from the OMAP-L13x series featuring a single 32-bit core running at 375 MHz in a 256-BGA (17×17) package. It targets embedded applications that require a balanced combination of compute, on-chip peripherals, and security features.

On-chip controllers and interfaces—including SDRAM controller, LCD display controller, Ethernet, SATA, USB with PHYs and HPI—provide integration for systems that combine connectivity, storage, and display functionality while operating across a wide temperature range.

Key Features

  • Core — Single ARM926EJ-S 32-bit core running at 375 MHz, suitable for general embedded processing tasks.
  • Memory and Bus — Integrated SDRAM controller to interface with external SDRAM devices for system memory.
  • Co-processors — Includes signal processing support (C674x) and system control coprocessor (CP15) to support dedicated processing tasks.
  • Display — Built-in LCD display controller for driving display panels and user interfaces.
  • Connectivity — 10/100 Mbps Ethernet interface for networked applications and an HPI interface for host parallel communication.
  • Storage — On-chip SATA 3 Gbps interface for direct connection to storage devices.
  • USB — USB 1.1 and USB 2.0 controllers with PHYs, enabling a range of USB peripheral and host configurations.
  • Security — Boot security and cryptography features to support secure boot and data protection functions.
  • Package and Mounting — 256-ball BGA package (17×17) with surface-mount mounting for compact PCB integration.
  • Operating Temperature — Rated for operation from −40 °C to 125 °C, supporting deployment in wide-temperature environments.
  • Graphics — No dedicated graphics acceleration included.

Typical Applications

  • Embedded control platforms — Single-core ARM processing with SDRAM support and HPI makes the device suitable for embedded controllers that require peripheral connectivity and external memory.
  • Networked appliances — Integrated 10/100 Mbps Ethernet and USB interfaces enable network connectivity and peripheral integration for connected devices.
  • Storage-enabled systems — SATA 3 Gbps interface provides direct attachment for storage subsystems and data-logging applications.
  • Human–machine interfaces (HMI) — On-chip LCD controller supports display-driven interfaces and control panels.
  • Wide-temperature embedded equipment — −40 °C to 125 °C operating range for systems deployed in harsh or industrial environments.

Unique Advantages

  • Integrated peripheral set: Ethernet, SATA, USB (1.1 and 2.0) with PHYs, LCD controller, and HPI reduce external component count and simplify board design.
  • Security primitives on-chip: Boot security and cryptography features support secure system boot and data protection without requiring additional security ICs.
  • Storage-ready interface: Native SATA 3 Gbps enables direct connection to disk or flash storage for data-intensive embedded applications.
  • Single-core deterministic compute: A 375 MHz ARM926EJ-S core provides consistent, predictable processing capability for control and real-time tasks.
  • Robust thermal range: −40 °C to 125 °C capability supports designs that must operate across wide temperature extremes.
  • Compact BGA footprint: The 256-ball 17×17 BGA package allows high-density PCB layouts while keeping a broad set of interfaces available.

Why Choose OMAPL137BZKBT3?

The OMAPL137BZKBT3 combines a 375 MHz ARM926EJ-S core with a broad set of integrated interfaces—Ethernet, SATA, USB with PHYs, LCD controller, SDRAM controller and HPI—making it a solid choice for embedded designs that require connectivity, storage, display and on-chip security. Its specification-driven feature set supports streamlined BOMs and compact board designs.

This device is suited for engineers and designers building networked or storage-capable embedded systems that need predictable single-core performance, integrated peripheral support, and operation across a wide temperature range. It offers a clear integration advantage for systems where these exact interfaces and operating conditions are required.

Request a quote or submit an inquiry to receive pricing and availability information for OMAPL137BZKBT3 and to discuss how it fits your next embedded design.

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