OMAPL137CZKBA3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 78 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137CZKBA3 – IC MPU OMAP-L1X 375MHZ 256BGA

The OMAPL137CZKBA3 is an ARM926EJ-S microprocessor IC from the Texas Instruments OMAP‑L13x series. It integrates a single 32‑bit ARM926EJ‑S core running at 375 MHz in a compact 256‑BGA (17×17) surface‑mount package.

Designed for embedded applications, this industrial‑grade device combines on‑chip connectivity (Ethernet, SATA, USB), SDRAM memory control, LCD display interfacing and security features such as boot security and cryptography, making it suitable for systems that require integration, connectivity and wide operating temperature support.

Key Features

  • Core and Performance Single ARM926EJ‑S 32‑bit core operating at 375 MHz for embedded control and processing tasks.
  • Co‑processors and System Control Includes signal processing co‑processor C674x and system control CP15 to support mixed processing workloads.
  • Memory SDRAM memory controller support for external system memory interfacing.
  • Display Integrated LCD display interface controller for HMI and display applications.
  • Ethernet 10/100 Mbps Ethernet port (1) for network connectivity.
  • SATA SATA 3 Gbps interface (1) for storage and mass‑data applications.
  • USB USB 1.1 + PHY (1) and USB 2.0 + PHY (1) for peripheral and host connectivity.
  • Security Boot security and cryptography features to support secure boot and data protection workflows.
  • Package and Mounting 256‑BGA (17×17) supplier device package, surface mount for compact board designs.
  • Industrial Grade & Temperature Rated for industrial operation with operating temperature from −40 °C to 105 °C.
  • Additional Interfaces Host Port Interface (HPI) for system expansion and peripheral interfacing.
  • Compliance RoHS compliant.
  • Graphics Acceleration No graphics acceleration included.

Typical Applications

  • Industrial Control Systems Embedded control platforms taking advantage of the device’s industrial temperature range and deterministic single‑core processing.
  • Networked Embedded Appliances Devices that require 10/100 Mbps Ethernet and SATA 3 Gbps for connectivity and local storage.
  • Human‑Machine Interfaces HMI and display controllers utilizing the integrated LCD interface and available USB connectivity.
  • Secure Embedded Devices Systems requiring boot security and cryptography for protected boot and data handling.

Unique Advantages

  • Single‑chip integration: Combines CPU core, memory controller and multiple peripheral interfaces to reduce BOM and simplify board‑level design.
  • Industrial temperature range: −40 °C to 105 °C rating supports deployment in demanding environmental conditions.
  • Broad I/O connectivity: On‑chip Ethernet, SATA and USB PHYs provide direct connectivity for networking, storage and peripherals.
  • Security features on‑chip: Boot security and cryptography capabilities help protect system integrity and sensitive data.
  • Compact 256‑BGA footprint: 17×17 mm BGA package enables space‑constrained board designs while maintaining required interfaces.
  • RoHS compliant: Meets environmental compliance requirements for lead‑free assembly.

Why Choose OMAPL137CZKBA3?

OMAPL137CZKBA3 positions itself as a compact, industrial‑grade microprocessor solution within the Texas Instruments OMAP‑L13x family. With a 375 MHz ARM926EJ‑S core, integrated memory controller, multiple on‑chip connectivity options (Ethernet, SATA, USB) and security features, it delivers a balanced mix of processing capability and system integration suitable for embedded designs.

This part is well suited to engineering teams building embedded control, networked appliance or HMI systems that require a consolidated feature set in a surface‑mount 256‑BGA package and extended operating temperature. As a member of the OMAP‑L13x series from Texas Instruments, it provides a consistent platform choice for designs prioritizing integration and industrial robustness.

Request a quote or submit an inquiry today to evaluate OMAPL137CZKBA3 for your embedded design and receive pricing and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1930


    Headquarters: Dallas, Texas, USA


    Employees: 34,000+


    Revenue: $17.52 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up