OMAPL137CZKBA3
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17) |
|---|---|
| Quantity | 78 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 256-BGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 256-BGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Speed | 375MHz | Supplier Device Package | 256-BGA (17×17) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL137CZKBA3 – IC MPU OMAP-L1X 375MHZ 256BGA
The OMAPL137CZKBA3 is an ARM926EJ-S microprocessor IC from the Texas Instruments OMAP‑L13x series. It integrates a single 32‑bit ARM926EJ‑S core running at 375 MHz in a compact 256‑BGA (17×17) surface‑mount package.
Designed for embedded applications, this industrial‑grade device combines on‑chip connectivity (Ethernet, SATA, USB), SDRAM memory control, LCD display interfacing and security features such as boot security and cryptography, making it suitable for systems that require integration, connectivity and wide operating temperature support.
Key Features
- Core and Performance Single ARM926EJ‑S 32‑bit core operating at 375 MHz for embedded control and processing tasks.
- Co‑processors and System Control Includes signal processing co‑processor C674x and system control CP15 to support mixed processing workloads.
- Memory SDRAM memory controller support for external system memory interfacing.
- Display Integrated LCD display interface controller for HMI and display applications.
- Ethernet 10/100 Mbps Ethernet port (1) for network connectivity.
- SATA SATA 3 Gbps interface (1) for storage and mass‑data applications.
- USB USB 1.1 + PHY (1) and USB 2.0 + PHY (1) for peripheral and host connectivity.
- Security Boot security and cryptography features to support secure boot and data protection workflows.
- Package and Mounting 256‑BGA (17×17) supplier device package, surface mount for compact board designs.
- Industrial Grade & Temperature Rated for industrial operation with operating temperature from −40 °C to 105 °C.
- Additional Interfaces Host Port Interface (HPI) for system expansion and peripheral interfacing.
- Compliance RoHS compliant.
- Graphics Acceleration No graphics acceleration included.
Typical Applications
- Industrial Control Systems Embedded control platforms taking advantage of the device’s industrial temperature range and deterministic single‑core processing.
- Networked Embedded Appliances Devices that require 10/100 Mbps Ethernet and SATA 3 Gbps for connectivity and local storage.
- Human‑Machine Interfaces HMI and display controllers utilizing the integrated LCD interface and available USB connectivity.
- Secure Embedded Devices Systems requiring boot security and cryptography for protected boot and data handling.
Unique Advantages
- Single‑chip integration: Combines CPU core, memory controller and multiple peripheral interfaces to reduce BOM and simplify board‑level design.
- Industrial temperature range: −40 °C to 105 °C rating supports deployment in demanding environmental conditions.
- Broad I/O connectivity: On‑chip Ethernet, SATA and USB PHYs provide direct connectivity for networking, storage and peripherals.
- Security features on‑chip: Boot security and cryptography capabilities help protect system integrity and sensitive data.
- Compact 256‑BGA footprint: 17×17 mm BGA package enables space‑constrained board designs while maintaining required interfaces.
- RoHS compliant: Meets environmental compliance requirements for lead‑free assembly.
Why Choose OMAPL137CZKBA3?
OMAPL137CZKBA3 positions itself as a compact, industrial‑grade microprocessor solution within the Texas Instruments OMAP‑L13x family. With a 375 MHz ARM926EJ‑S core, integrated memory controller, multiple on‑chip connectivity options (Ethernet, SATA, USB) and security features, it delivers a balanced mix of processing capability and system integration suitable for embedded designs.
This part is well suited to engineering teams building embedded control, networked appliance or HMI systems that require a consolidated feature set in a surface‑mount 256‑BGA package and extended operating temperature. As a member of the OMAP‑L13x series from Texas Instruments, it provides a consistent platform choice for designs prioritizing integration and industrial robustness.
Request a quote or submit an inquiry today to evaluate OMAPL137CZKBA3 for your embedded design and receive pricing and availability information.

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