OMAPL137DZKB3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 721 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137DZKB3 – IC MPU OMAP‑L1x 375 MHz, 256‑BGA

The OMAPL137DZKB3 is a single‑core ARM926EJ‑S microprocessor operating at 375 MHz, designed for embedded applications requiring integrated I/O and on‑chip system features. It combines a 32‑bit core with dedicated co‑processor support, memory controller, display controller and a range of connectivity and storage interfaces.

This device targets embedded and commercial applications that benefit from on‑chip Ethernet, SATA and USB connectivity, LCD display control and built‑in security features such as boot protection and cryptography.

Key Features

  • Core  ARM926EJ‑S single 32‑bit core running at 375 MHz for deterministic embedded processing.
  • Co‑processors  Includes DSP and system control co‑processor support: Signal Processing (C674x) and System Control (CP15) for off‑loaded signal workloads and system management.
  • Memory & Display  SDRAM memory controller and an integrated LCD display controller to support typical embedded memory and display requirements.
  • Connectivity & Networking  Integrated 10/100 Mbps Ethernet interface to support networked embedded devices.
  • Storage  On‑chip SATA 3 Gbps interface for direct connection to high‑speed storage devices.
  • USB & Peripherals  Includes USB 1.1 + PHY and USB 2.0 + PHY interfaces plus an HPI for parallel host peripheral connectivity.
  • Security  Built‑in boot security and cryptography features to support secure boot and basic on‑device cryptographic functions.
  • Package & Mounting  256‑BGA (17 × 17 mm) surface‑mount package suitable for compact board designs.
  • Operating Range  Commercial temperature grade with an operating range of 0 °C to 90 °C.
  • Regulatory  RoHS compliant.
  • Graphics  No hardware graphics acceleration included.

Typical Applications

  • Embedded Systems  Central processor for embedded applications requiring a compact, single‑core 32‑bit MPU with integrated I/O and memory interfaces.
  • Networked Devices  Networked appliances and gateways that use the on‑chip 10/100 Mbps Ethernet and USB connectivity.
  • Storage‑Enabled Products  Devices that require local storage connectivity via the on‑chip SATA 3 Gbps interface.
  • Human‑Machine Interfaces  Control of LCD displays and local user interfaces where an SDRAM controller and LCD interface are required.

Unique Advantages

  • Integrated I/O Suite: Combines Ethernet, SATA, USB 1.1 and USB 2.0 with PHYs and an LCD controller to reduce external component count.
  • DSP Offload Capability: Support for C674x signal processing co‑processor enables off‑loading of compute‑intensive signal tasks from the main core.
  • Compact, Industry‑Standard Package: 256‑BGA (17×17 mm) surface‑mount package enables dense PCB layouts for space‑constrained designs.
  • Built‑in Security: Boot security and cryptography features help implement secure device start‑up and basic cryptographic functions.
  • Commercial Temperature Grade: Operates across 0 °C to 90 °C to meet a wide range of commercial environment requirements.
  • RoHS Compliant: Environmentally compliant manufacturing status to meet regulatory and customer requirements.

Why Choose OMAPL137DZKB3?

The OMAPL137DZKB3 positions itself as a compact, integrated microprocessor solution for embedded commercial applications that need a 32‑bit ARM926EJ‑S core with a broad set of on‑chip interfaces. Its combination of Ethernet, SATA, USB, LCD controller and security functions simplifies system design by reducing external components.

This device is suitable for engineers implementing embedded networked products, storage‑enabled devices or HMI applications where a single‑core MPU with DSP offload capability and commercial temperature operation provides the required balance of performance and integration. Manufactured by Texas Instruments, it offers a clear specification set for procurement and system design.

If you would like pricing or availability for OMAPL137DZKB3, request a quote or submit your purchase inquiry and our team will respond with the latest information and lead‑time details.

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