OMAPL137DZKBT3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 1,346 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeAutomotiveGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137DZKBT3 – ARM926EJ-S 375MHz 256-BGA Microprocessor

The OMAPL137DZKBT3 from Texas Instruments is a single-core, 32-bit microprocessor based on the ARM926EJ-S core, running at 375 MHz. It is part of the OMAP-L13x series and integrates a broad set of memory controllers and peripheral interfaces for embedded system designs.

With on-chip co-processors for signal processing and system control, integrated connectivity options and security features, this device targets embedded applications that require a compact, feature-rich processing platform and extended operating temperature capability.

Key Features

  • Processor Core  ARM926EJ-S, single 32-bit core running at 375 MHz for deterministic embedded processing.
  • Co-processors  Includes a C674x signal-processing co-processor and CP15 system control for dedicated computation and control tasks.
  • Memory Controller  SDRAM controller on-chip to interface with external memory for system and application storage needs.
  • Display and HMI  Integrated LCD display controller and host port interface (HPI) to support human-machine interfaces and peripheral communications.
  • Connectivity and Storage  Built-in networking and storage interfaces including 10/100 Mbps Ethernet (1), SATA 3 Gbps (1), and both USB 1.1 + PHY and USB 2.0 + PHY options.
  • Security  Hardware features for boot security and cryptography to help protect system integrity and data.
  • Package and Mounting  256-ball BGA package (17 × 17 mm) designed for surface-mount assembly in compact board layouts.
  • Operating Range & Compliance  Rated for operation from −40 °C to 125 °C and RoHS compliant.

Typical Applications

  • Embedded Control and Industrial Systems  On-chip controllers, wide temperature rating and integrated interfaces suit machine control and automation modules.
  • Networked Storage and Gateway Devices  SATA and 10/100 Ethernet enable local storage subsystems and network connectivity in compact systems.
  • Human-Machine Interfaces  LCD controller plus USB support facilitates user interface control and peripheral integration.
  • Signal Processing Modules  C674x signal-processing co-processor supports dedicated DSP workloads within embedded designs.

Unique Advantages

  • Broad peripheral integration: Ethernet, SATA, USB, LCD and HPI reduce external component count and simplify PCB design.
  • Dedicated DSP support: On-chip C674x signal-processing capability accelerates compute-intensive embedded algorithms without adding external DSP chips.
  • Built-in security: Boot security and cryptography functions help protect platform integrity and sensitive data at the hardware level.
  • Temperature resilience: −40 °C to 125 °C operating range supports deployment in temperature-challenging environments.
  • Compact BGA package: 256-BGA (17 × 17 mm) enables higher board density and surface-mount manufacturing.
  • RoHS compliant: Conforms to lead-free environmental requirements for compliant product builds.

Why Choose OMAPL137DZKBT3?

The OMAPL137DZKBT3 positions itself as a highly integrated embedded processing option combining a 375 MHz ARM926EJ-S core with co-processor acceleration, multiple storage and network interfaces, and hardware security features. Its compact 256-BGA package and wide operating temperature range make it suitable for designs that require both integration density and environmental robustness.

Engineers and procurement teams will find this device appropriate for embedded designs that need on-chip connectivity and signal-processing capabilities, backed by Texas Instruments' OMAP-L13x series platform and RoHS compliance for regulated builds.

Request a quote or submit a quote to evaluate OMAPL137DZKBT3 for your next embedded design.

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