OMAPL138AZWT3

IC MPU OMAP-L1X 300MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 300MHz 361-NFBGA (16x16)

Quantity 1,219 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed300MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138AZWT3 – ARM926EJ-S 300 MHz MPU, 361‑NFBGA

The OMAPL138AZWT3 is a 32‑bit microprocessor IC featuring an ARM926EJ‑S core running at 300 MHz, designed for embedded applications requiring balanced control and signal‑processing connectivity. The device integrates system control coprocessor functionality along with a C674x signal‑processing co‑processor capability, and provides a broad set of interfaces for connectivity and memory integration.

This part targets commercial embedded markets where integration of Ethernet, storage, and USB interfaces with SDRAM/DDR memory support and hardware security features is required, while offering a surface‑mount 361‑ball BGA package and RoHS compliance for manufacturability.

Key Features

  • Core  ARM926EJ‑S 32‑bit processor core at 300 MHz; single core implementation suitable for control and application tasks.
  • Coprocessor / DSP Support  Signal processing support via C674x designation and system control via CP15, enabling offload of compute‑intensive signal tasks.
  • Memory and External Interfaces  SDRAM memory controller listed; datasheet series information also documents EMIFA and DDR2/mDDR memory controller options for flexible external memory configurations.
  • Connectivity  Integrated 10/100 Mbps Ethernet (1), SATA 3 Gbps (1) and both USB 1.1 + PHY and USB 2.0 + PHY interfaces for high‑throughput peripheral and network connections.
  • Display and Host Interfaces  LCD controller and Host Port Interface (HPI) for display and host communication use cases.
  • Security  Boot security and cryptography features to support secure boot and data protection mechanisms.
  • Package and Mounting  361‑ball NFBGA / LFBGA package (16 × 16 mm footprint) designed for surface‑mount assembly.
  • Environmental and Grade  Commercial grade device with an operating temperature range of 0 °C to 90 °C and RoHS compliance for environmental regulation adherence.
  • Graphics Acceleration  No graphics acceleration—suitable when application processing focuses on control, connectivity and DSP tasks rather than GPU workloads.

Typical Applications

  • Industrial Control  Real‑time control and communications where the ARM core and DSP support combined with Ethernet and SATA connectivity enable local processing and data storage.
  • Networking Gateways  Embedded gateway devices utilizing 10/100 Ethernet and USB interfaces for protocol bridging and peripheral attachment.
  • Multimedia and Display Controllers  Systems that require LCD control and DSP‑assisted media processing while relying on external memory for frame buffers and assets.
  • Storage‑Enabled Embedded Systems  Designs requiring on‑board SATA connectivity for local data logging or content distribution paired with secure boot capabilities.

Unique Advantages

  • Integrated I/O Mix: Combines Ethernet, SATA and USB PHYs on a single device to reduce external interface components and simplify board routing.
  • DSP‑Ready Architecture: Presence of C674x signal‑processing support enables offloading of intensive signal or media algorithms from the ARM core.
  • Flexible Memory Options: SDRAM controller plus series documentation of EMIFA and DDR2/mDDR support allows designs to choose memory topology that matches capacity and performance needs.
  • Security Primitives Onboard: Boot security and cryptography features provide a foundation for secure system startup and protected data handling.
  • Manufacturing‑Friendly Package: 361‑ball BGA in a 16 × 16 mm footprint facilitates compact designs and automated surface‑mount assembly.
  • Regulatory and Production Readiness: RoHS compliance and commercial temperature grading support mainstream production and deployment environments.

Why Choose OMAPL138AZWT3?

The OMAPL138AZWT3 positions itself as a practical, integrated microprocessor solution for embedded designs that need a 300 MHz ARM926EJ‑S core combined with signal‑processing capability and a wide set of peripheral interfaces. Its combination of Ethernet, SATA, USB, LCD control, and flexible memory interfacing helps reduce external component count while enabling reliable data handling and connectivity.

This device is suited to engineers building commercial embedded systems where balanced control performance, onboard security features, and a compact BGA package are priorities. The available system interfaces and memory support offer scalability for designs that may require local storage, network connectivity, or DSP‑assisted processing.

Request a quote or submit an inquiry to receive pricing and availability for the OMAPL138AZWT3 and to discuss how it fits your embedded design requirements.

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