OMAPL138AZCEA3

IC MPU OMAP-L1X 300MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 300MHz 361-NFBGA (13x13)

Quantity 331 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed300MHz
Supplier Device Package361-NFBGA (13×13)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138AZCEA3 – IC MPU OMAP-L1X 300MHZ 361NFBGA

The OMAPL138AZCEA3 is a 32-bit ARM926EJ-S microprocessor IC clocked at 300 MHz, offered in a 361‑NFBGA (13×13) surface-mount package and rated for industrial operation. It targets embedded and industrial applications that require a compact, integrated MPU with on-chip system interfaces and security features.

Designed for integration into embedded systems, this device combines an ARM926EJ-S core with a C674x signal-processing co-processor and a broad set of peripheral controllers to support networking, storage, display and I/O tasks in temperature‑sensitive environments.

Key Features

  • Core 32‑bit ARM926EJ‑S core running at 300 MHz; includes system control (CP15) for standard ARM memory and control features.
  • Co‑processor / DSP C674x signal‑processing co‑processor for offloading compute‑intensive signal tasks and accelerating DSP workloads.
  • Memory and Cache On‑chip memory architecture and external memory controller support; SDRAM controller included for system memory integration.
  • Storage and Networking Integrated SATA 3 Gbps interface and single 10/100 Mbps Ethernet controller to support local storage and network connectivity.
  • USB and Display Built‑in USB 1.1 + PHY and USB 2.0 + PHY interfaces plus an LCD controller for embedded HMI and peripheral connectivity.
  • I/O and Expansion Host Port Interface (HPI) and additional serial peripherals (UART/SPI available on the series) for flexible sensor and peripheral connections.
  • Security Boot security and cryptography features to support secured boot and cryptographic operations.
  • Package and Mounting 361‑NFBGA package (13×13 mm) in a surface‑mount form factor suited to compact board designs.
  • Industrial Grade Rated operating temperature from −40 °C to 105 °C for deployment in demanding environments. RoHS compliant.

Typical Applications

  • Industrial Control Use in embedded controllers where a hardened industrial temperature range and integrated I/O (Ethernet, USB, SATA) are required.
  • Networking and Communications Suitable for networked embedded devices that need 10/100 Mbps Ethernet connectivity and storage via SATA.
  • Human‑Machine Interfaces Drives LCD displays and manages USB peripherals for operator panels and machine interfaces.
  • Signal Processing Systems Leverages the C674x co‑processor to accelerate audio, sensor, or DSP workloads alongside the ARM core.

Unique Advantages

  • Integrated multimedia and I/O set: On‑chip LCD controller, USB (1.1 and 2.0), Ethernet and SATA reduce external components and simplify board design.
  • Combined MPU + DSP capability: ARM926EJ‑S paired with a C674x co‑processor allows separation of control and signal processing tasks for efficient system partitioning.
  • Industrial temperature rating: −40 °C to 105 °C operation supports deployment in harsh and temperature‑variable environments.
  • Security features onboard: Boot security and cryptography support improve platform integrity and help meet application security requirements.
  • Compact BGA package: 361‑NFBGA (13×13) enables high‑density integration in space‑constrained embedded designs.

Why Choose OMAPL138AZCEA3?

OMAPL138AZCEA3 positions itself as a compact, industrial‑grade embedded processor that combines an ARM926EJ‑S control core with a C674x signal‑processing co‑processor and a rich set of interfaces (Ethernet, SATA, USB, LCD, HPI). This combination provides a practical platform for designers who need both general‑purpose processing and dedicated signal processing in a single package.

The device is well suited to engineers building industrial controllers, HMI devices, networked appliances and signal‑processing systems that benefit from integrated interfaces, security features and a robust operating temperature range. Its package and interface set allow designers to reduce BOM complexity and accelerate time to market while maintaining design flexibility.

Request a quote or submit an inquiry to receive pricing and availability for OMAPL138AZCEA3 and to discuss how this device can fit your next embedded design.

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