OMAPL137BZKBD4

IC MPU OMAP-L1X 456MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 256-BGA (17x17)

Quantity 670 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed456MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137BZKBD4 – IC MPU OMAP-L1X 456MHz 256-BGA

The OMAPL137BZKBD4 is an ARM926EJ-S microprocessor packaged in a 256-ball BGA (17×17) for surface-mount assembly. It provides a single 32‑bit core running at 456 MHz with integrated peripherals targeted at embedded and industrial applications.

With on-chip SDRAM controller, multiple host and peripheral interfaces, and built-in security features, this device is suited for embedded systems requiring a combination of compute performance, peripheral integration, and industrial temperature operation.

Key Features

  • Core ARM926EJ-S 32‑bit processor core running at 456 MHz, single-core configuration for deterministic embedded processing.
  • Co-processors Includes signal-processing coprocessor C674x and system control CP15 for offloaded signal tasks and system management.
  • Memory and Display SDRAM memory controller and an integrated LCD display controller for direct interfacing to display panels.
  • High-speed Interfaces On-chip Ethernet 10/100 Mbps (1), SATA 3 Gbps (1), USB 2.0 + PHY (1) and USB 1.1 + PHY (1) for networking, storage and peripheral connectivity.
  • Additional Interfaces Host Port Interface (HPI) for parallel host access and system integration.
  • Security Boot security and cryptography features to support secure boot and data protection workflows.
  • Package and Mounting 256‑BGA (17×17) supplier device package, designed for surface-mount assembly.
  • Industrial Grade and Temperature Rated for industrial operation with an operating temperature range of –40 °C to 90 °C.
  • Environmental Compliance RoHS compliant.
  • Graphics Acceleration No dedicated graphics acceleration.

Typical Applications

  • Industrial Control Systems Industrial-grade temperature range and integrated Ethernet and I/O make it suitable for control and monitoring devices.
  • Networking and Communications Appliances Built-in 10/100 Mbps Ethernet plus USB and HPI enable networked gateway and peripheral connectivity designs.
  • Data Storage and Gateway Devices SATA 3 Gbps and USB interfaces support local storage and data-aggregation applications.
  • Human-Machine Interfaces (HMI) LCD controller and embedded processing capability allow implementation of operator displays and panel controllers.

Unique Advantages

  • Integrated Peripheral Set: Ethernet, SATA, USB 2.0/1.1 and HPI reduce external component count and simplify board design.
  • Industrial Temperature Rating: –40 °C to 90 °C operation supports deployment in harsh environments.
  • Security Built In: Boot security and cryptography features help protect device integrity and stored data.
  • Compact BGA Package: 256‑BGA (17×17) enables a small PCB footprint while supporting dense integration.
  • Signal Processing Offload: On-chip C674x signal-processing coprocessor allows dedicated handling of DSP tasks alongside the ARM core.
  • RoHS Compliant: Compliant with RoHS for environmental and regulatory alignment.

Why Choose OMAPL137BZKBD4?

The OMAPL137BZKBD4 combines a 456 MHz ARM926EJ-S core with a broad set of integrated interfaces and security features in a compact 256‑BGA package. Its industrial temperature rating and on-chip peripherals provide a balanced platform for embedded designs that require reliable connectivity, storage and display capability without extensive external circuitry.

This device is well suited to engineers and procurement teams building industrial embedded systems, networked appliances, storage gateways, or HMI devices who need a single-chip solution offering compute, I/O and security in a RoHS-compliant footprint.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the OMAPL137BZKBD4.

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