OMAPL137BZKBA3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 1,156 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of OMAPL137BZKBA3 – IC MPU OMAP-L1X 375MHZ 256BGA

The OMAPL137BZKBA3 is an ARM926EJ‑S microprocessor IC in the OMAP-L13x series from Texas Instruments, featuring a single 32-bit core running at 375 MHz. Designed for embedded and industrial systems, it combines a deterministic application processor core with integrated interfaces for networking, storage and human‑machine interface tasks.

With on-chip SDRAM controller and display support, multiple wired connectivity options and industrial temperature capability, this device targets designs that require reliable operation across harsh environments and compact surface‑mount packaging.

Key Features

  • Processor Core ARM926EJ‑S single 32‑bit core operating at 375 MHz, suitable for control and general embedded processing tasks.
  • Co‑processors Includes signal processing and system control co‑processor designations (C674x for signal processing; CP15 for system control) to support specialized processing paths.
  • Memory and Display Integrated SDRAM controller and LCD display controller simplify memory and display subsystem design for embedded HMI applications.
  • Connectivity and Storage Built‑in interfaces include 10/100 Mbps Ethernet (1), SATA 3 Gbps (1) and USB 1.1 + PHY and USB 2.0 + PHY, enabling networked and local storage connectivity without external bridge chips.
  • Peripheral Interfaces Additional interfaces include HPI for host peripheral interactions, expanding I/O flexibility for control and data acquisition functions.
  • Security Boot security and cryptography features are provided to support secure device initialization and data protection workflows.
  • Package and Mounting Supplied in a 256‑BGA (17 × 17 mm) package for surface‑mount assembly, facilitating compact board layouts.
  • Industrial Temperature Range Rated for operation from ‑40 °C to 105 °C, meeting the thermal needs of industrial and field‑deployed equipment.
  • RoHS Compliant Conforms to RoHS requirements for hazardous substance reduction in electronics manufacturing.

Typical Applications

  • Industrial Control and Automation — Single‑core ARM processing with industrial temperature rating supports control logic, protocol handling and I/O aggregation in factory and process automation equipment.
  • Networked Storage and Gateways — Integrated 10/100 Ethernet and SATA 3 Gbps make the device suitable for compact network gateways and local storage controllers.
  • Human‑Machine Interfaces (HMI) — On‑chip LCD controller and SDRAM interface enable operator panels and embedded displays for machine monitoring and control.
  • Embedded Connectivity Devices — Multiple USB PHYs, Ethernet and HPI support peripheral connectivity, data collection and local communication tasks in embedded appliances.

Unique Advantages

  • Integrated Connectivity Suite: Ethernet, SATA and dual USB PHYs reduce external component count and simplify system design for networked and storage applications.
  • Industrial‑Ready Thermal Range: Rated from ‑40 °C to 105 °C to maintain operation in demanding field and industrial environments.
  • Security‑Focused Boot: Built‑in boot security and cryptography features support secure startup and data protection policies.
  • Compact Surface‑Mount Package: 256‑BGA (17 × 17 mm) packaging enables dense PCB layouts and reliable surface‑mount assembly.
  • Single‑Core Deterministic Processing: ARM926EJ‑S at 375 MHz provides consistent performance for control and embedded application tasks.
  • RoHS Compliance: Meets environmental requirements for modern electronics manufacturing.

Why Choose OMAPL137BZKBA3?

The OMAPL137BZKBA3 positions itself as a compact, industrial‑grade embedded processor option within the OMAP‑L13x series from Texas Instruments. Its 375 MHz ARM926EJ‑S core combined with integrated SDRAM/display support, multiple wired connectivity options and security features makes it suitable for designers who need a reliable, integrated solution for control, HMI and networked storage applications.

Choose this part when your design priorities include a surface‑mount 256‑BGA footprint, industrial temperature operation and on‑chip connectivity to minimize external components while retaining deterministic embedded processing capability.

Request a quote or submit a procurement inquiry today to evaluate OMAPL137BZKBA3 for your next embedded or industrial design.

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