OMAPL137BPTPH
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 300MHz 176-HLQFP (24x24) |
|---|---|
| Quantity | 229 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 176-HLQFP (24x24) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A001A2A | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -55°C ~ 175°C (TJ) | Package / Case | 176-LQFP Exposed Pad | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 300MHz | ||
| Supplier Device Package | 176-HLQFP (24×24) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL137BPTPH – IC MPU OMAP-L1X 300MHZ 176HLQFP
The OMAPL137BPTPH is an ARM926EJ-S based microprocessor in the OMAP-L13x series from Texas Instruments. It is a single-core, 32-bit MPU running at 300 MHz, targeted for embedded applications that require integrated connectivity and system control functions.
Designed for embedded systems, this device integrates communication interfaces, SDRAM support, and security features in a 176-HLQFP (24×24) exposed-pad package, and is offered with an extended operating temperature range for robust deployments.
Key Features
- Core ARM926EJ-S single-core, 32-bit processor operating at 300 MHz for deterministic embedded control and processing.
- Co‑processors Integrated co-processor support including Signal Processing (C674x) and System Control (CP15) to offload specialized tasks.
- Memory and Display SDRAM controller for external memory interfacing and an LCD display interface controller for straightforward user-interface integration.
- Connectivity Built-in 10/100 Mbps Ethernet (1), SATA 3 Gbps (1), USB 1.1 + PHY (1) and USB 2.0 + PHY (1) to support networking, storage, and USB peripherals.
- Additional Interfaces Host Port Interface (HPI) for parallel data transfers and system-level communication.
- Security Boot security and cryptography features to support secure system startup and data protection workflows.
- Graphics No dedicated graphics acceleration—suitable for applications that rely on CPU-driven graphics or simple LCD control.
- Package and Mounting 176-LQFP exposed pad (supplier package: 176-HLQFP 24×24) in a surface-mount form factor for compact board integration.
- Operating Range and Compliance Rated for operation from −55 °C to 175 °C and RoHS compliant for broad environmental deployment.
Typical Applications
- Embedded Networking Appliances Use the integrated 10/100 Ethernet and USB interfaces for networked control and peripheral connectivity.
- Storage and Gateway Devices SATA 3 Gbps plus USB and Ethernet support make this MPU suitable for compact storage gateways and data bridge applications.
- Industrial Control and Instrumentation Extended temperature rating and SDRAM support enable deployment in industrial controllers and instrumentation requiring robust operation.
- Human‑Machine Interfaces (HMIs) LCD controller and HPI support allow implementation of operator displays and panel control systems.
Unique Advantages
- Integrated connectivity: Ethernet, SATA and USB PHYs onboard reduce external component count for networking and storage designs.
- Security-ready boot and cryptography: Built-in features support secure boot and cryptographic functions to protect system integrity.
- Deterministic single-core performance: ARM926EJ-S at 300 MHz provides predictable processing for control-oriented embedded tasks.
- Industrial temperature capability: −55 °C to 175 °C rating supports harsh-environment applications without additional thermal qualification.
- Compact exposed‑pad package: 176-HLQFP (24×24) surface-mount package balances board density and thermal performance.
- RoHS compliant: Environmentally compliant manufacturing and materials.
Why Choose OMAPL137BPTPH?
The OMAPL137BPTPH positions itself as a compact, integrated MPU solution for embedded systems requiring a combination of processing determinism, connectivity and security. Its ARM926EJ-S core at 300 MHz paired with co-processor support, SDRAM interface and multiple peripheral PHYs enables integration of networking, storage and interface functions in a single device.
This part is well suited to engineers designing embedded controllers, industrial instrumentation, storage gateways and HMI devices that need robust temperature performance, secure boot capability and a reduced BOM through on-chip connectivity. Backed by the OMAP-L13x series architecture, it offers a practical balance of integration and reliability for long-term embedded deployments.
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