OMAPL137BZKB3

The OMAPL137BZKB3 is a Texas Instruments microprocessor IC from the OMAP-L13x series featuring a single ARM926EJ-S 32-bit core running at 375 MHz. Designed for embedded applications, it integrates a range of system interfaces and on-chip controllers to streamline connected and storage-capable designs.

With integrated peripherals such as Ethernet, SATA and USB, along with SDRAM support and on-chip security features, the device targets embedded and commercial-grade products that require a compact, surface-mount solution in a 256-BGA (17×17) package.

Key Features

• Core ARM926EJ-S single 32-bit core running at 375 MHz for deterministic embedded processing.
• Co-processors Includes signal-processing support (C674x) and system control (CP15) co-processor functionality to offload specialized tasks.
• Memory controller Integrated SDRAM controller for external memory interface support.
• High-speed interfaces On-chip 10/100 Mbps Ethernet and one SATA 3 Gbps interface provide wired networking and storage connectivity.
• USB connectivity Supports USB 1.1 with PHY and USB 2.0 with PHY for flexible peripheral and host options.
• Display interface Integrated LCD controller for simple display subsystem integration.
• Security features Boot security and cryptography functions enable basic device and boot integrity capabilities.
• Package and mounting 256-ball BGA (17×17) surface-mount package for compact board-level integration.
• Operating range and grade Commercial grade with an operating temperature range of 0 °C to 90 °C; RoHS compliant.
• Additional interfaces Host Port Interface (HPI) available for parallel processor communication.

Typical Applications

• Connected embedded devices — Use the integrated Ethernet interface for networked appliances and communication gateways.
• Storage-enabled systems — SATA 3 Gbps enables direct connection to storage subsystems in embedded controllers and media appliances.
• USB peripherals and hosts — USB 1.1 and USB 2.0 with PHY support attach a wide range of external peripherals or act as host controllers.
• Display-driven interfaces — The LCD controller is suitable for operator panels, control displays, and HMI elements in embedded products.

Unique Advantages

• Integrated high-speed I/O: Ethernet and SATA on-chip reduce external component count and simplify board design for connected and storage applications.
• Dual USB PHY support: Native USB 1.1 and USB 2.0 PHYs provide flexible connectivity options without added PHY components.
• Security-ready boot: Built-in boot security and cryptography support help protect system integrity from power-up.
• Compact BGA package: 256-BGA (17×17) surface-mount package enables high-density PCB layouts in space-constrained designs.
• Commercial temperature suitability: Rated 0 °C to 90 °C for a wide range of commercial embedded environments.
• Series-level design continuity: Part of the OMAP-L13x series, facilitating design reuse within the same product family.

Why Choose OMAPL137BZKB3?

The OMAPL137BZKB3 combines a 375 MHz ARM926EJ-S core with integrated high-speed interfaces and security features to deliver a balanced platform for embedded applications that require networking, storage, and peripheral connectivity in a compact package. Its on-chip SDRAM controller and co-processor support simplify system architecture while keeping board-level integration efficient.

This device is well suited for commercial embedded product designers seeking a single-chip solution with a mix of I/O, security, and display support within the OMAP-L13x series. Its package, interface set, and operating range provide a practical foundation for mid-performance embedded systems where integration and predictable behavior are priorities.

Request a quote or submit your parts request today to receive pricing and availability for the OMAPL137BZKB3.