OMAPL138BZCEA3

The OMAPL138BZCEA3 is a 32‑bit embedded microprocessor IC featuring an ARM926EJ‑S core running at 375 MHz and an integrated C674x signal‑processing DSP co‑processor. It is part of the OMAP‑L13x family and targets industrial embedded systems that require combined general‑purpose processing and DSP acceleration.

Designed for applications requiring broad on‑chip integration, the device includes multi‑level cache and shared RAM, a rich set of peripheral interfaces (Ethernet, SATA, USB, LCD, HPI), and hardware security features. The device is rated for industrial temperature use and is RoHS compliant, offering a compact 361‑NFBGA (13×13) surface‑mount package.

Key Features

• Core and DSP One ARM926EJ‑S 32‑bit MPU core at 375 MHz paired with a TMS320C674x floating‑point VLIW DSP co‑processor for signal‑processing tasks; DSP performance figures in the datasheet include up to 3648 MIPS and 2746 MFLOPS.
• Two‑level Cache and On‑chip RAM Integrated cache/memory architecture with 32KB L1 program (L1P), 32KB L1 data (L1D), a 256KB L2 unified mapped RAM/cache and 128KB of shared RAM for tightly coupled MPU/DSP data exchange.
• Memory Controllers and External Memory EMIFA for NOR/NAND, support for 16‑bit SDRAM (128‑MB address space) and 16‑bit DDR2 SDRAM (256‑MB address space) via the DDR2/Mobile DDR memory controller.
• High‑speed Interfaces Integrated 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 + PHY and USB 2.0 + PHY, plus an LCD controller and Host Port Interface (HPI) for external masters.
• Enhanced DMA and Peripheral Engines EDMA3 with multiple controllers, 64 independent DMA channels, 3 transfer controllers and 16 Quick DMA channels for high‑throughput data movement and programmable burst sizes.
• Security and System Control Boot security and cryptography features together with system control CP15 for platform management.
• Industrial Grade Package and Temperature 361‑pin NFBGA (13×13) surface‑mount package; operating temperature −40 °C to 105 °C; RoHS compliant.
• Software and Development Support Documented software support including TI DSP/BIOS, Chip Support Library and DSP Library referenced in the datasheet.

Typical Applications

• Industrial Control and Automation Suitable for control systems that need a deterministic MPU with DMA and DSP resources for real‑time signal processing and peripheral interfacing.
• Networking and Communications Integrated Ethernet, USB and SATA make the device appropriate for networked appliances, gateways and embedded communication nodes.
• Multimedia and Display Control On‑chip LCD controller combined with DSP acceleration supports embedded HMI and media preprocessing tasks.
• Storage and Data Logging SATA 3 Gbps and NAND/NOR EMIFA support enable compact storage controllers and data acquisition systems.

Unique Advantages

• Heterogeneous Processing in One Device: Combines an ARM926EJ‑S MPU with a C674x DSP co‑processor to offload compute‑intensive signal tasks while retaining general‑purpose control.
• Rich I/O Integration: On‑chip Ethernet, SATA, USB (1.1 and 2.0 with PHY), LCD and HPI reduce external component count and simplify board design.
• Robust Memory Subsystem: Two‑level cache, substantial L2 and shared RAM improve real‑time performance and data exchange between MPU and DSP cores.
• High‑throughput Data Movement: EDMA3 with 64 channels and multiple controllers enables efficient peripheral and memory transfers for throughput‑sensitive designs.
• Industrial Reliability: Rated for −40 °C to 105 °C and shipped in a compact 361‑NFBGA package suitable for industrial embedded applications.
• Established Software Support: Documented TI software components (DSP/BIOS, libraries) help accelerate development and integration.

Why Choose OMAPL138BZCEA3?

OMAPL138BZCEA3 positions itself as an integrated solution for embedded designs that require a balance of control and high‑performance signal processing. With a 375 MHz ARM926EJ‑S core, a C674x DSP co‑processor, a comprehensive memory architecture and extensive on‑chip interfaces, it reduces BOM complexity while delivering deterministic performance for industrial applications.

This device is well suited to engineers building industrial control, networking, multimedia or storage systems who need long‑term platform stability, software library support and a compact surface‑mount package rated for industrial temperatures. The combination of integrated peripherals, DMA throughput and security features provides a scalable foundation for robust embedded products.

Request a quote or submit your requirements to receive pricing, lead‑time and availability information for OMAPL138BZCEA3.