OMAPL138BZCED4E

IC MPU OMAP-L1X 456MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (13x13)

Quantity 36 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (13x13)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed456MHz
Supplier Device Package361-NFBGA (13×13)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138BZCED4E – IC MPU OMAP-L1X 456MHz 361-NFBGA

The OMAPL138BZCED4E is an industrial-grade microprocessor IC built around an ARM926EJ-S 32-bit core running at 456 MHz. Designed for embedded applications, this device combines an ARM MPU with a C674x signal-processing coprocessor and a broad set of peripherals to enable real-time control, connectivity, and local storage in industrial and embedded systems.

With integrated memory controllers, display and I/O interfaces, security features and a 361-ball NFBGA (13×13) package rated for –40 °C to 90 °C operation, this part suits designs that require robust integration, deterministic processing and a compact surface-mount form factor.

Key Features

  • Core and DSP — ARM926EJ-S 32-bit processor core at 456 MHz with a C674x DSP coprocessor for signal-processing tasks, providing mixed MPU/DSP capabilities on a single device.
  • Memory and DMA — On-chip memory and cache for both cores (ARM: 16 KB instruction cache, 16 KB data cache, 8 KB vector RAM, 64 KB ROM; DSP: 32 KB L1P, 32 KB L1D, 256 KB L2 unified mapped RAM/cache) and an Enhanced DMA controller (EDMA3) for high-throughput data movement.
  • External Memory Interfaces — SDRAM controller plus flexible external memory interface (EMIFA) and support for DDR2/Mobile DDR memory options as detailed in the device datasheet.
  • Display and Host Interfaces — Integrated LCD display controller and Host Port Interface (HPI) for display and peripheral interfacing.
  • Connectivity — 10/100 Mbps Ethernet port, SATA 3 Gbps interface and dual USB support (USB 1.1 + PHY and USB 2.0 + PHY) for networked and storage-enabled embedded applications.
  • Storage Support — On-chip support for NOR and NAND configurations via external memory interfaces and high-speed SATA connectivity for local mass storage.
  • Security — Boot security and cryptography features to support secure boot and data protection requirements.
  • Package and Temperature — 361-ball NFBGA (13×13) surface-mount package, industrial grade with an operating temperature range of –40 °C to 90 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Automation — Real-time control and signal processing using the ARM core plus C674x DSP, with industrial temperature rating and Ethernet connectivity for factory networks.
  • Embedded Networking & Gateways — Integrated Ethernet and USB/PHY interfaces enable networked edge devices and communication gateways with local storage via SATA.
  • Human‑Machine Interfaces (HMI) — Built-in LCD controller and host interfaces allow compact HMI designs that combine user display control with backend processing.
  • Data Acquisition & Signal Processing — DSP coprocessor and EDMA support high-rate data movement and real-time filtering, decoding or preprocessing at the edge.

Unique Advantages

  • Integrated MPU + DSP Architecture: Combines a 456 MHz ARM926EJ-S core with a C674x DSP coprocessor to consolidate control and signal-processing tasks on a single device, reducing board-level complexity.
  • Broad I/O and Storage Options: On-chip Ethernet, SATA 3 Gbps and dual USB PHYs let designers implement networked, USB-connected and storage-enabled systems without extensive external logic.
  • Robust Memory Subsystem: Multi-level on-chip caches and RAM for both ARM and DSP cores, plus external SDRAM/DDR2 support and EMIFA for flexible memory configurations and high throughput.
  • Security and Reliable Boot: Built-in boot security and cryptography features support secure start-up and protect sensitive data in embedded deployments.
  • Industrial Temperature & Packaging: 361-NFBGA surface-mount package rated for –40 °C to 90 °C, suitable for industrial environments requiring extended temperature operation.
  • Software Ecosystem Support: Series-level software support includes TI DSP/BIOS, chip support libraries and DSP libraries to accelerate development (refer to the device datasheet for details).

Why Choose OMAPL138BZCED4E?

The OMAPL138BZCED4E positions itself as a highly integrated embedded processor for designs that need a balance of general-purpose control and dedicated signal-processing horsepower. Its combination of an ARM926EJ-S core at 456 MHz, C674x DSP coprocessor, substantial on-chip memory/cache resources and a wide set of connectivity options makes it suitable for compact, industrial-grade systems where deterministic performance and peripheral integration reduce overall system complexity.

With security features, EDMA for efficient data movement, and an industrial temperature rating, this device is appropriate for OEMs and system designers targeting robust embedded applications that benefit from a consolidated MPU/DSP platform and established software support.

Request a quote or submit a pricing inquiry today to discuss availability, lead times and volume options for OMAPL138BZCED4E.

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